Inventor · disambiguated record
Loic Pierre Louis Renard
Also filed as: RENARD LOCI · RENARD LOIC · RENARD LOIC PIERRE LOUIS · RENARD LOÏC
7 granted patents·7 pending applications·43 citations·filing 1999–2024
80Inventor score
Files withST MICROELECTRONICS PTE LTD8ST MICROELECTRONICS SRL3RENARD LOÏC2ST MICROELECTRONICS INT NV1
Top patents by PatentIndex Score
14 records- 0189US9911890B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2016·Granted Mar 6, 2018·14 cites·24 claims
- 0281US10347786B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2018·Granted Jul 9, 2019·2 cites·20 claims
- 0368US10749067B2Optical sensor package including a cavity formed in an image sensor dieST MICROELECTRONICS PTE LTD·Filed 2019·Granted Aug 18, 2020·0 cites·21 claims
- 0463US9723186B2Low profile camera module with image compensationST MICROELECTRONICS PTE LTD·Filed 2014·Granted Aug 1, 2017·1 cites·16 claims
- 0559US2024421055A1Semiconductor packaging with embedded emf shielding protection using wire bondingST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0657US6260753B1Gold bumps bonding on connection pads and subsequent coining of their vertexST MICROELECTRONICS SRL·Filed 1999·Granted Jul 17, 2001·26 cites·25 claims
- 0757US2022368100A1Optical integrated circuit sensor package using a stacked configuration for the sensor die and the emitter dieST MICROELECTRONICS PTE LTD·Filed 2022·Application pending·0 cites
- 0855US2024030115A1Power package with copper plating and molding structureST MICROELECTRONICS PTE LTD·Filed 2023·Application pending·0 cites
- 0942US2016104805A1Optical semiconductor device including blackened tarnishable bond wires and related methodsST MICROELECTRONICS PTE LTD·Filed 2014·Application pending·0 cites
- 1034US2004072396A1Semiconductor electronic device and method of manufacturing thereofST MICROELECTRONICS SRL·Filed 2003·Application pending·0 cites
- 1133US2003146500A1Package for semiconductor device with ground lead connection having high stress resistanceST MICROELECTRONICS SRL·Filed 2002·Application pending·0 cites
- 1232US2017263565A1Integrated circuit (ic) package with a grounded electrically conductive shield layer and associated methodsST MICROELECTRONICS PTE LTD·Filed 2016·Application pending·0 cites
- 1331US9308231B2Anti-inflammatory composition comprising malvidin-3-O-β-glucoside and a propolis extractRENARD LOÏC·Filed 2012·Granted Apr 12, 2016·0 cites·16 claims
- 1429US9636365B2Antibacterial food compositionRENARD LOÏC·Filed 2010·Granted May 2, 2017·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →