Inventor · disambiguated record
Lung-Hsin Chen
Also filed as: CHEN LUNG · CHEN LUNG-HSIN
78 granted patents·45 pending applications·242 citations·filing 1999–2023
98Inventor score
Files withADVANCED OPTOELECTRONIC TECH86TAIWAN SEMICONDUCTOR MFG CO LTD10HSIEH MIN-TSUN7CHEN LUNG-HSIN5ADVANCED OPTOELECTRIC TECHNOLOGY INC2
Top patents by PatentIndex Score
123 records- 0196US9431591B1LED package with reflecting cupADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Aug 30, 2016·8 cites·15 claims
- 0293US7719099B2Package structure for solid-state lighting devices and method of fabricating the sameADVANCED OPTOELECTRONIC TECH·Filed 2006·Granted May 18, 2010·20 cites·22 claims
- 0392US8470621B2Method for fabricating a flip-chip semiconductor optoelectronic deviceKUO CHESTER·Filed 2010·Granted Jun 25, 2013·19 cites·14 claims
- 0489US10147805B2Structure and formation method of semiconductor device structure with a dummy fin structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 4, 2018·6 cites·20 claims
- 0588US9543486B1LED package with reflecting cupADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Jan 10, 2017·6 cites·17 claims
- 0687US7994628B2Package structure of photoelectronic device and fabricating method thereofADVANCED OPTOELECTRIC TECHNOLOGY INC·Filed 2008·Granted Aug 9, 2011·14 cites·18 claims
- 0785US10672870B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·4 cites·18 claims
- 0883US10008568B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 26, 2018·5 cites·20 claims
- 0980US10505023B2Structure and formation method of semiconductor device structure with a dummy fin structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 1078US7989237B2Package structure for solid-state lighting devices and method of fabricating the sameADVANCES OPTOELECTRONIC TECHNOLOGY INC·Filed 2008·Granted Aug 2, 2011·8 cites·22 claims
- 1176USD644189SLED light barADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Aug 30, 2011·22 cites·1 claims
- 1273US9147809B1Flip chip light emitting diode packaging structureADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Sep 29, 2015·2 cites·13 claims
- 1373US9048394B2Light emitting diode package with oxidation-resistant metal coating layerADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jun 2, 2015·3 cites·20 claims
- 1473US8772062B2Method for manufacturing light emitting diode package having LED die fixed by anisotropic conductive pasteADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jul 8, 2014·3 cites·14 claims
- 1572US6083766APackaging method of thin film passive components on silicon chipVIKING TECH CORP·Filed 1999·Granted Jul 4, 2000·41 cites·8 claims
- 1671US8979312B2Light emitting diode bulbADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Mar 17, 2015·3 cites·9 claims
- 1770US11081571B2Structure and formation method of semiconductor device structure with a dummy fin structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 3, 2021·0 cites·20 claims
- 1869US8921131B2Method for manufacturing light emitting diode packageCHEN LUNG-HSIN·Filed 2012·Granted Dec 30, 2014·1 cites·20 claims
- 1966US12040384B2Source/drain structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·20 claims
- 2065US9012248B2Method for packaging light emitting diodeCHEN LUNG-HSIN·Filed 2012·Granted Apr 21, 2015·2 cites·8 claims
- 2164US10890802B2Optical lens, backlight module and display device using sameADVANCED OPTOELECTRONIC TECH·Filed 2019·Granted Jan 12, 2021·0 cites·14 claims
- 2264US6268225B1Fabrication method for integrated passive componentVIKING TECHNOLOGY CORP·Filed 1999·Granted Jul 31, 2001·18 cites·15 claims
- 2363US10727321B2Structure and formation method of semiconductor device structure with a dummy fin structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 28, 2020·0 cites·20 claims
- 2463US9324702B2Photoelectric deviceADVANCED OPTOELECTRONIC TECH·Filed 2014·Granted Apr 26, 2016·1 cites·14 claims
- 2562USD763206SLight emitting diode packageADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Aug 9, 2016·9 cites·1 claims
- 2662US9184358B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Nov 10, 2015·1 cites·12 claims
- 2761US9065028B2Flip-chip light emitting diode package with moisture barrier layerADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jun 23, 2015·1 cites·18 claims
- 2861US9040321B2Method for manufacturing light emitting diode packagesZHONGSHAN INNOCLOUD IP SERVICES CO LTD·Filed 2014·Granted May 26, 2015·1 cites·19 claims
- 2961US8828755B2Light-emitting element package and fabrication method thereofADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Sep 9, 2014·0 cites·9 claims
- 3061US8384276B2LED lamp structureADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Feb 26, 2013·1 cites·7 claims
- 3160US11121217B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 3259USD654444SLED moduleLIN CHIH-YUNG·Filed 2010·Granted Feb 21, 2012·11 cites·1 claims
- 3359US7508007B2Package structure of light-emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2007·Granted Mar 24, 2009·1 cites·12 claims
- 3455US9437585B2Photoelectric device and method of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Granted Sep 6, 2016·0 cites·12 claims
- 3554US2015003080A1Light emitting diode moduleADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3654US2025089285A1Semiconductor device and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3752US9899587B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Feb 20, 2018·0 cites·4 claims
- 3852US9842968B2LED packageADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Dec 12, 2017·0 cites·12 claims
- 3952US8960955B2LED lamp having a large illumination angleADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 24, 2015·0 cites·20 claims
- 4051US10872892B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 4151US9666568B2Photoelectric device and method of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2016·Granted May 30, 2017·0 cites·7 claims
- 4250US10133133B1Liquid crystal display baseADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Nov 20, 2018·0 cites·10 claims
- 4350US9746162B2Light emitting diode bulbADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Aug 29, 2017·0 cites·20 claims
- 4450US9620692B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Apr 11, 2017·0 cites·11 claims
- 4550US8981447B2Light emitting diode packageADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Mar 17, 2015·0 cites·6 claims
- 4650US8956893B2Metiod of making LED with bat-wing emitting field lensADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 17, 2015·0 cites·16 claims
- 4750US2015009680A1Lens and light emitting element using the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 4850US2013248922A1Flip-chip semiconductor optoelectronic device and method for fabricating the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Application pending·0 cites
- 4949US9660144B2LED package and LED dieADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted May 23, 2017·0 cites·13 claims
- 5049US9465205B2Optical lens and backlight module incorporating the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Granted Oct 11, 2016·0 cites·10 claims
Showing the top 50 of 123 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →