Inventor · disambiguated record
Lung-Tai Chen
Also filed as: CHEN LUNG-TAI
14 granted patents·3 pending applications·400 citations·filing 1995–2023
91Inventor score
Top patents by PatentIndex Score
17 records- 0194US5903052AStructure for semiconductor package for improving the efficiency of spreading heatIND TECH RES INST·Filed 1998·Granted May 11, 1999·329 cites·16 claims
- 0284US12191219B2Gas-permeable package lid of chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2022·Granted Jan 7, 2025·1 cites·18 claims
- 0383US8693711B2Capacitive transducer and fabrication methodHO TZONG-CHE·Filed 2009·Granted Apr 8, 2014·15 cites·15 claims
- 0481US8421543B2Crystal oscillator and method for manufacturing the sameHSU YU-WEN·Filed 2011·Granted Apr 16, 2013·7 cites·17 claims
- 0578US8643125B2Structure and process for microelectromechanical system-based sensorCHEN LUNG-TAI·Filed 2011·Granted Feb 4, 2014·4 cites·8 claims
- 0672US9445212B2MEMS microphone module and manufacturing process thereofCHEN LUNG-TAI·Filed 2008·Granted Sep 13, 2016·6 cites·9 claims
- 0769US7791181B2Device structure with preformed ring and method thereforIND TECH RES INST·Filed 2008·Granted Sep 7, 2010·4 cites·8 claims
- 0866US7973454B1Vacuum hermetic organic packaging carrier and sensor device packageIND TECH RES INST·Filed 2010·Granted Jul 5, 2011·2 cites·13 claims
- 0965US8763457B2Sensing device and manufacturing method thereofCHEN LUNG-TAI·Filed 2011·Granted Jul 1, 2014·2 cites·19 claims
- 1064US9343651B2Organic packaging carrierCHEN LUNG-TAI·Filed 2012·Granted May 17, 2016·2 cites·7 claims
- 1163US7915065B2Wafer level sensing package and manufacturing process thereofIND TECH RES INST·Filed 2008·Granted Mar 29, 2011·2 cites·10 claims
- 1262US5695109ASolder paste inter-layer alignment apparatus for area-array on-board reworkIND TECH RES INST·Filed 1995·Granted Dec 9, 1997·25 cites·7 claims
- 1360US8421216B2Vacuum hermetic organic packaging carrierCHEN LUNG-TAI·Filed 2011·Granted Apr 16, 2013·1 cites·12 claims
- 1454US2024363456A1Gas-permeable package lid of chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2023·Application pending·0 cites
- 1549US9133018B2Structure and fabrication method of a sensing deviceCHEN LUNG-TAI·Filed 2009·Granted Sep 15, 2015·0 cites·14 claims
- 1649US2009121299A1Wafer level sensing package and manufacturing process thereofIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1737US2013153418A1Sensing device and fabricating method thereofCHEN LUNG-TAI·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Lung-Tai Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →