Inventor · disambiguated record
Luc Guerin
Also filed as: GUERIN LUC · GUERIN LUC G · GUERIN LUC GILBERT
24 granted patents·1 pending application·193 citations·filing 1999–2019
95Inventor score
Top patents by PatentIndex Score
25 records- 0192US10784202B2High-density chip-to-chip interconnection with silicon bridgeIBM·Filed 2017·Granted Sep 22, 2020·33 cites·15 claims
- 0290US8290008B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2009·Granted Oct 16, 2012·18 cites·12 claims
- 0389US9553079B1Flip chip assembly with connected componentIBM·Filed 2015·Granted Jan 24, 2017·7 cites·5 claims
- 0488US6532654B2Method of forming an electrical connectorIBM·Filed 2001·Granted Mar 18, 2003·38 cites·24 claims
- 0586US8559474B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2012·Granted Oct 15, 2013·9 cites·6 claims
- 0683US6302702B1Connecting devices and method for interconnecting circuit componentsIBM·Filed 2000·Granted Oct 16, 2001·30 cites·9 claims
- 0782US9865564B2Laser ashing of polyimide for semiconductor manufacturingGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 9, 2018·4 cites·20 claims
- 0881US10211174B2Flip chip assembly with connected componentIBM·Filed 2017·Granted Feb 19, 2019·3 cites·4 claims
- 0973US9793232B1All intermetallic compound with stand off feature and method to makeIBM·Filed 2016·Granted Oct 17, 2017·2 cites·20 claims
- 1070US8148255B2Techniques for forming solder bump interconnectsDANG BING·Filed 2007·Granted Apr 3, 2012·2 cites·19 claims
- 1169US6339534B1Compliant leads for area array surface mounted componentsIBM·Filed 1999·Granted Jan 15, 2002·29 cites·14 claims
- 1267US9269603B2Temporary liquid thermal interface material for surface tension adhesion and thermal controlIBM·Filed 2013·Granted Feb 23, 2016·2 cites·16 claims
- 1365US7837419B2Methods involving marking moldsIBM·Filed 2007·Granted Nov 23, 2010·1 cites·12 claims
- 1463US8614512B2Solder ball contact susceptible to lower stressGUERIN LUC·Filed 2012·Granted Dec 24, 2013·2 cites·18 claims
- 1562US7868459B2Semiconductor package having non-aligned active viasIBM·Filed 2006·Granted Jan 11, 2011·2 cites·7 claims
- 1661US7312523B2Enhanced via structure for organic module performanceIBM·Filed 2005·Granted Dec 25, 2007·2 cites·20 claims
- 1757US7066740B2Area array package with low inductance connecting deviceIBM·Filed 2003·Granted Jun 27, 2006·7 cites·25 claims
- 1856US8328156B2Techniques for forming solder bump interconnectsDANG BING·Filed 2012·Granted Dec 11, 2012·0 cites·2 claims
- 1953US9984988B2Flip chip assembly with connected componentIBM·Filed 2017·Granted May 29, 2018·0 cites·16 claims
- 2046US8383505B2Solder ball contact susceptible to lower stressIBM·Filed 2011·Granted Feb 26, 2013·0 cites·15 claims
- 2146US6652290B2Connecting devices and method for interconnecting circuit componentsIBM·Filed 2001·Granted Nov 25, 2003·2 cites·2 claims
- 2243US2007007323A1Standoff structures for surface mount componentsIBM·Filed 2005·Application pending·0 cites
- 2342US10926813B2Wind deflector for a vehicle towing a trailerGUERIN LUC·Filed 2019·Granted Feb 23, 2021·0 cites·18 claims
- 2442US8999107B2Laser ashing of polyimide for semiconductor manufacturingCADOTTE MAXIME·Filed 2011·Granted Apr 7, 2015·0 cites·14 claims
- 2536US8514386B2Technique for verifying the microstructure of lead-free interconnects in semiconductor assembliesBERGERON CHRISTIAN·Filed 2011·Granted Aug 20, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →