Inventor · disambiguated record
Luping Huang
Also filed as: HUANG LUPING
4 granted patents·17 citations·filing 2014–2016
70Inventor score
Technology areasH10P
Files withKLA TENCOR CORP4
Top patents by PatentIndex Score
4 records- 0185US9960070B2Chucking warped wafer with bellowsKLA TENCOR CORP·Filed 2015·Granted May 1, 2018·7 cites·9 claims
- 0281US9653338B2System and method for non-contact wafer chuckingKLA TENCOR CORP·Filed 2014·Granted May 16, 2017·7 cites·37 claims
- 0365US10468288B2Methods and systems for chucking a warped waferKLA TENCOR CORP·Filed 2016·Granted Nov 5, 2019·2 cites·15 claims
- 0460US10381256B2Apparatus and method for chucking warped wafersKLA TENCOR CORP·Filed 2016·Granted Aug 13, 2019·1 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →