Inventor · disambiguated record
Lu-Chen Hwan
Also filed as: HWAN LU-CHEN
15 granted patents·5 pending applications·87 citations·filing 2002–2019
90Inventor score
Files withMUTUAL PAK TECHNOLOGY CO LTD13CHIPBOND TECHNOLOGY CORP3HWAN LU-CHEN2MUTUAL PAK TECH CO LTD1
Top patents by PatentIndex Score
20 records- 0182US7886421B2Method for manufacturing integrated circuit device having antenna conductorsMUTUAL PAK TECHNOLOGY CO LTD·Filed 2010·Granted Feb 15, 2011·7 cites·4 claims
- 0280US7459345B2Packaging method for an electronic elementMUTUAL PAK TECHNOLOGY CO LTD·Filed 2004·Granted Dec 2, 2008·31 cites·10 claims
- 0380US7273768B2Wafer-level package and IC module assembly method for the wafer-level packageMUTUAL PAK TECHNOLOGY CO LTD·Filed 2005·Granted Sep 25, 2007·11 cites·6 claims
- 0478US7772698B2Package structure for integrated circuit deviceMUTUAL PAK TECHNOLOGY CO LTD·Filed 2008·Granted Aug 10, 2010·8 cites·8 claims
- 0577US7943426B2Package structure for integrated circuit device and method of the sameMUTUAL PAK TECHNOLOGY CO LTD·Filed 2009·Granted May 17, 2011·8 cites·18 claims
- 0664US9105814B2Light emitting diode and method of the sameHWAN LU-CHEN·Filed 2009·Granted Aug 11, 2015·4 cites·8 claims
- 0762US6602762B2System and method of laser sintering dies and dies sintered by laser sinteringCHIPBOND TECHNOLOGY CORP·Filed 2002·Granted Aug 5, 2003·10 cites·5 claims
- 0857US6940183B1Compound filled in lead IC packaging productFiled 2004·Granted Sep 6, 2005·8 cites·8 claims
- 0951US7999191B2Method for making cable with a conductive bump array, and method for connecting the cable to a task objectMUTUAL PAK TECHNOLOGY CO LTD·Filed 2007·Granted Aug 16, 2011·0 cites·10 claims
- 1049US8344500B2Integrated circuit package module and method of the sameMUTUAL PAK TECHNOLOGY CO LTD·Filed 2009·Granted Jan 1, 2013·0 cites·20 claims
- 1149US7698805B2Method for manufacturing integrated circuit device having antenna conductorsMUTUAL PAK TECHNOLOGY CO LTD·Filed 2008·Granted Apr 20, 2010·0 cites·14 claims
- 1246US7312142B2Method for making cable with a conductive bump array, and method for connecting the cable to a task objectMUTUAL PAK TECHNOLOGY CO LTD·Filed 2005·Granted Dec 25, 2007·0 cites·13 claims
- 1344US2015171041A1Chip element and chip packageMUTUAL PAK TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1442US8344734B2Test module for radio frequency identification chips and method of the sameMUTUAL PAK TECHNOLOGY CO LTD·Filed 2009·Granted Jan 1, 2013·0 cites·6 claims
- 1542US2010267204A1Package structure for integrated circuit device and method of the sameMUTUAL PAK TECHNOLOGY CO LTD·Filed 2010·Application pending·0 cites
- 1640US7413670B2Method for forming wiring on a substrateMUTUAL PAK TECHNOLOGY CO LTD·Filed 2004·Granted Aug 19, 2008·0 cites·5 claims
- 1736US9136585B2Radio frequency identification tagHWAN LU-CHEN·Filed 2012·Granted Sep 15, 2015·0 cites·11 claims
- 1835US2002180064A1Metallized surface wafer level package structureCHIPBOND TECHNOLOGY CORP·Filed 2002·Application pending·0 cites
- 1934US2003203209A1System and method of laser sintering dies and dies sintered by laser sinteringCHIPBOND TECHNOLOGY CORP·Filed 2003·Application pending·0 cites
- 2031US2019348589A1Light-emitting diode structureMUTUAL PAK TECH CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →