Inventor · disambiguated record
Luke D. Lacroix
Also filed as: LACROIX LUKE D
8 granted patents·36 citations·filing 1997–2015
81Inventor score
Top patents by PatentIndex Score
8 records- 0177US8653662B2Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuitsLACROIX LUKE D·Filed 2012·Granted Feb 18, 2014·5 cites·19 claims
- 0273US8759977B2Elongated via structuresLACROIX LUKE D·Filed 2012·Granted Jun 24, 2014·3 cites·12 claims
- 0366US9599664B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresIBM·Filed 2015·Granted Mar 21, 2017·1 cites·19 claims
- 0462US9057760B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresLACROIX LUKE D·Filed 2011·Granted Jun 16, 2015·1 cites·18 claims
- 0562US8586982B2Semiconductor test chip device to mimic field thermal mini-cycles to assess reliabilityLACROIX LUKE D·Filed 2010·Granted Nov 19, 2013·1 cites·20 claims
- 0661US6260163B1Testing high I/O integrated circuits on a low I/O testerIBM·Filed 1997·Granted Jul 10, 2001·25 cites·38 claims
- 0752US8999846B2Elongated via structuresIBM·Filed 2014·Granted Apr 7, 2015·0 cites·18 claims
- 0843US9093445B2Packaging identical chips in a stacked structureCOLGAN EVAN G·Filed 2011·Granted Jul 28, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →