Inventor · disambiguated record
Lu-Ming Lai
Also filed as: LAI LU-MING
47 granted patents·23 pending applications·40 citations·filing 2010–2025
96Inventor score
Files withADVANCED SEMICONDUCTOR ENG58EVERLIGHT ELECTRONICS CO LTD6LAI LU-MING4ADVANCED SEMICONDUCTORY ENGINEERING INC1HSIN CHIA-FEN1
Top patents by PatentIndex Score
70 records- 0195US11276806B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 15, 2022·4 cites·22 claims
- 0293US10812017B1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 20, 2020·12 cites·17 claims
- 0387US2025334402A1Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0485US12352602B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Jul 8, 2025·0 cites·13 claims
- 0581US2025115473A1Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0680US11211536B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 28, 2021·1 cites·2 claims
- 0778US11835363B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 5, 2023·0 cites·11 claims
- 0878US11081413B2Semiconductor package with inner and outer cavitiesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·3 cites·20 claims
- 0978US2025096774A1Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1077US2024427092A1Optical moduleADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1176US12184266B2Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 31, 2024·0 cites·10 claims
- 1276US11088054B2Lead frame and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 10, 2021·2 cites·17 claims
- 1376US9711473B1Semiconductor die, semiconductor wafer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jul 18, 2017·2 cites·19 claims
- 1476US8056247B2Tilt sensorLAI LU-MING·Filed 2010·Granted Nov 15, 2011·8 cites·14 claims
- 1574US10752494B2Semiconductor device packageADVANCED SEMICONDUCTORY ENGINEERING INC·Filed 2018·Granted Aug 25, 2020·1 cites·27 claims
- 1673US12168605B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 17, 2024·0 cites·16 claims
- 1773US11784296B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 10, 2023·0 cites·16 claims
- 1872US10436635B2Active optical component with passive optical component and encapsulant for an optical device and electrical device including the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Oct 8, 2019·2 cites·16 claims
- 1970US11562969B2Semiconductor device package including reinforced structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 24, 2023·1 cites·19 claims
- 2069US12085768B2Optical moduleADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 10, 2024·0 cites·18 claims
- 2168US10720751B2Optical package structure, optical module, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jul 21, 2020·1 cites·21 claims
- 2268US10069051B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 4, 2018·1 cites·20 claims
- 2366US11588470B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·0 cites·16 claims
- 2466US11262197B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 1, 2022·0 cites·18 claims
- 2564US11296651B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 5, 2022·0 cites·5 claims
- 2663US11276720B2Optical packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·0 cites·19 claims
- 2762US10689249B2Semiconductor device package including a wall and a grounding ring exposed from the wallADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 23, 2020·1 cites·16 claims
- 2862US10665765B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted May 26, 2020·0 cites·26 claims
- 2961US10170658B2Semiconductor package structures and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jan 1, 2019·1 cites·21 claims
- 3061US2025316312A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 3160US2021183839A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 3259US11817397B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 14, 2023·0 cites·19 claims
- 3359US11014806B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 25, 2021·0 cites·17 claims
- 3459US2025048760A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3559US2025167131A1Optical package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3656US10508910B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 17, 2019·0 cites·27 claims
- 3755US11682684B2Optical package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 20, 2023·0 cites·15 claims
- 3855US10629787B2Lid and an optical device package having the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 21, 2020·0 cites·5 claims
- 3954US11535509B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 27, 2022·0 cites·13 claims
- 4053US11588081B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·0 cites·12 claims
- 4152US11495511B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 8, 2022·0 cites·17 claims
- 4251US11437292B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 6, 2022·0 cites·15 claims
- 4350US11217499B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 4, 2022·0 cites·4 claims
- 4449US11565934B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 4548US12321513B2Body-part tracking device and body-part tracking methodADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 3, 2025·0 cites·19 claims
- 4648US2018017741A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Application pending·0 cites
- 4748US2017287863A1Semiconductor die, semiconductor wafer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Application pending·0 cites
- 4847US11427466B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 30, 2022·0 cites·16 claims
- 4947US11091365B2MEMS package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 17, 2021·0 cites·19 claims
- 5046US11276797B2Optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·0 cites·14 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →