Inventor · disambiguated record
Luis J. Matienzo
Also filed as: KOTYLO JOSEPH ALPHONSE · MATIENZO LUIS J · MATIENZO LUIS JESUS
56 granted patents·8 pending applications·945 citations·filing 1991–2011
99Inventor score
Top patents by PatentIndex Score
64 records- 0194US6252012B1Method for producing a diffusion barrier and polymeric article having a diffusion barrierIBM·Filed 1999·Granted Jun 26, 2001·69 cites·8 claims
- 0294US5693928AMethod for producing a diffusion barrier and polymeric article having a diffusion barrierIBM·Filed 1996·Granted Dec 2, 1997·74 cites·11 claims
- 0390US5372848AProcess for creating organic polymeric substrate with copperIBM·Filed 1992·Granted Dec 13, 1994·74 cites·21 claims
- 0489US6104093AThermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 1998·Granted Aug 15, 2000·92 cites·15 claims
- 0588US6410988B1Thermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 2000·Granted Jun 25, 2002·45 cites·18 claims
- 0684US6074895AMethod of forming a flip chip assemblyIBM·Filed 1997·Granted Jun 13, 2000·63 cites·14 claims
- 0781US7342183B2Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Mar 11, 2008·7 cites·19 claims
- 0880US6522014B1Fabrication of a metalized blind viaIBM·Filed 2000·Granted Feb 18, 2003·23 cites·20 claims
- 0978US5958996AMethod for producing a diffusion barrier and polymeric article having a diffusion barrierIBM·Filed 1997·Granted Sep 28, 1999·23 cites·8 claims
- 1077US6206997B1Method for bonding heat sinks to overmolds and device formed therebyIBM·Filed 1999·Granted Mar 27, 2001·36 cites·10 claims
- 1176US6519845B1Wire bonding to dual metal covered pad surfacesIBM·Filed 2000·Granted Feb 18, 2003·20 cites·13 claims
- 1275US6596559B2Flip-chip package with optimized encapsulant adhesion and methodIBM·Filed 2001·Granted Jul 22, 2003·17 cites·21 claims
- 1373US7823274B2Method of making multilayered circuitized substrate assemblyENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Nov 2, 2010·4 cites·4 claims
- 1473US6759597B1Wire bonding to dual metal covered pad surfacesIBM·Filed 1998·Granted Jul 6, 2004·36 cites·6 claims
- 1573US6265462B1Method for Producing a Diffusion Barrier and Polymeric Article Having a Diffusion BarrierIBM·Filed 2000·Granted Jul 24, 2001·7 cites·8 claims
- 1671US5532024AMethod for improving the adhesion of polymeric adhesives to nickel surfacesIBM·Filed 1995·Granted Jul 2, 1996·36 cites·17 claims
- 1769US7334323B2Method of making mutilayered circuitized substrate assembly having sintered paste connectionsENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Feb 26, 2008·4 cites·21 claims
- 1868US6719871B2Method for bonding heat sinks to overmolds and device formed therebyIBM·Filed 2001·Granted Apr 13, 2004·10 cites·10 claims
- 1966US6306683B1Method of forming a flip chip assembly, and a flip chip assembly formed by the methodIBM·Filed 2000·Granted Oct 23, 2001·16 cites·42 claims
- 2066US6252307B1Structure for preventing adhesive bleed onto surfacesIBM·Filed 2000·Granted Jun 26, 2001·12 cites·12 claims
- 2166US6250540B1Fluxless joining process for enriched soldersIBM·Filed 1999·Granted Jun 26, 2001·23 cites·20 claims
- 2266US6210781B1Method for photoselective seeding and metallization of three-dimensional materialsIBM·Filed 1999·Granted Apr 3, 2001·18 cites·13 claims
- 2365US6908684B2Promoting adhesion between a polymer and a metallic substrateIBM·Filed 2004·Granted Jun 21, 2005·3 cites·10 claims
- 2465US6576996B2Method for bonding heat sinks to overmolds and device formed therebyIBM·Filed 2001·Granted Jun 10, 2003·8 cites·6 claims
- 2565US6022596AMethod for photoselective seeding and metallization of three-dimensional materialsIBM·Filed 1996·Granted Feb 8, 2000·17 cites·30 claims
- 2663US6284329B1Method of forming adherent metal components on a polyimide substrateIBM·Filed 1999·Granted Sep 4, 2001·20 cites·15 claims
- 2761US7307022B2Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereofENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Dec 11, 2007·1 cites·21 claims
- 2861US6194076B1Method of forming adherent metal components on a polyimide substrateIBM·Filed 1997·Granted Feb 27, 2001·19 cites·2 claims
- 2960US6447914B1Method of uniformly depositing seed and a conductor and the resultant printed circuit structureIBM·Filed 2000·Granted Sep 10, 2002·3 cites·15 claims
- 3059US6348737B1Metallic interlocking structureIBM·Filed 2000·Granted Feb 19, 2002·8 cites·14 claims
- 3158US6348738B1Flip chip assemblyIBM·Filed 1999·Granted Feb 19, 2002·17 cites·7 claims
- 3258US5997997AMethod for reducing seed deposition in electroless platingIBM·Filed 1997·Granted Dec 7, 1999·15 cites·18 claims
- 3357US6693031B2Formation of a metallic interlocking structureIBM·Filed 2002·Granted Feb 17, 2004·7 cites·18 claims
- 3456US6713858B2Flip-chip package with optimized encapsulant adhesion and methodIBM·Filed 2003·Granted Mar 30, 2004·5 cites·4 claims
- 3556US6576549B2Fabrication of a metalized blind viaIBM·Filed 2002·Granted Jun 10, 2003·5 cites·23 claims
- 3655US6656313B2Structure and method for improved adhesion between two polymer filmsIBM·Filed 2001·Granted Dec 2, 2003·3 cites·25 claims
- 3754US6613184B1Stable interfaces between electrically conductive adhesives and metalsIBM·Filed 1997·Granted Sep 2, 2003·17 cites·14 claims
- 3854US6607613B2Solder ball with chemically and mechanically enhanced surface propertiesIBM·Filed 2001·Granted Aug 19, 2003·5 cites·12 claims
- 3953US6056831AProcess for chemically and mechanically enhancing solder surface propertiesIBM·Filed 1998·Granted May 2, 2000·13 cites·19 claims
- 4053US6017613AMethod for photoselective seeding and metallization of three-dimensional materialsIBM·Filed 1996·Granted Jan 25, 2000·11 cites·13 claims
- 4153US2008054476A1Circuitized substrate with increased roughness conductive layer as part thereofENDICOTT INTERCONNECT TECH INC·Filed 2007·Application pending·0 cites
- 4251US6136513AMethod of uniformly depositing seed and a conductor and the resultant printed circuit structureIBM·Filed 1998·Granted Oct 24, 2000·12 cites·21 claims
- 4349US6770968B2Method for bonding heat sinks to overmolds and device formed therebyIBM·Filed 2003·Granted Aug 3, 2004·2 cites·8 claims
- 4449US6420253B2Method for preventing adhesive bleed onto surfacesIBM·Filed 2001·Granted Jul 16, 2002·3 cites·13 claims
- 4549US5935652AMethod for reducing seed deposition in electroless platingIBM·Filed 1998·Granted Aug 10, 1999·11 cites·22 claims
- 4649US2008105457A1Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereofENDICOTT INTERCONNECT TECH INC·Filed 2008·Application pending·0 cites
- 4748US2011139364A1Chemical modification of chromate conversion coated aluminum work piecesMATIENZO LUIS J·Filed 2009·Application pending·0 cites
- 4847US6232363B1Method for producing a diffusion barrier and polymeric article having a diffusion barrierIBM·Filed 2000·Granted May 15, 2001·0 cites·8 claims
- 4946US7309529B2Structure and method for improved adhesion between two polymer filmsIBM·Filed 2004·Granted Dec 18, 2007·0 cites·14 claims
- 5045US8293141B2Electronic device comprising electrically stable copper filled electrically conductive adhesiveGAYNES MICHAEL·Filed 2008·Granted Oct 23, 2012·0 cites·13 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →