Inventor · disambiguated record
Lyndon Graham
Also filed as: GRAHAM LYNDON · GRAHAM LYNDON W
24 granted patents·17 pending applications·789 citations·filing 1997–2023
97Inventor score
Top patents by PatentIndex Score
41 records- 0194US5985126ASemiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric coverSEMITOOL INC·Filed 1997·Granted Nov 16, 1999·121 cites·28 claims
- 0292US6270647B1Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operationsSEMITOOL INC·Filed 1999·Granted Aug 7, 2001·134 cites·15 claims
- 0392US6099712ASemiconductor plating bowl and method using anode shieldSEMITOOL INC·Filed 1997·Granted Aug 8, 2000·83 cites·11 claims
- 0491US6551479B1Apparatus for controlling and/or measuring additive concentration in an electroplating bathSEMITOOL INC·Filed 2000·Granted Apr 22, 2003·46 cites·16 claims
- 0590US6508920B1Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic deviceSEMITOOL INC·Filed 1999·Granted Jan 21, 2003·88 cites·53 claims
- 0687US6921468B2Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operationsSEMITOOL INC·Filed 2001·Granted Jul 26, 2005·40 cites·8 claims
- 0785US7135404B2Method for applying metal features onto barrier layers using electrochemical depositionSEMITOOL INC·Filed 2003·Granted Nov 14, 2006·24 cites·22 claims
- 0884US6365033B1Methods for controlling and/or measuring additive concentration in an electroplating bathSEMITOOF INC·Filed 1999·Granted Apr 2, 2002·63 cites·68 claims
- 0982US6806186B2Submicron metallization using electrochemical depositionSEMITOOL INC·Filed 2001·Granted Oct 19, 2004·21 cites·22 claims
- 1078US7300562B2Platinum alloy using electrochemical depositionSEMITOOL INC·Filed 2003·Granted Nov 27, 2007·9 cites·8 claims
- 1177US6599412B1In-situ cleaning processes for semiconductor electroplating electrodesSEMITOOL INC·Filed 1997·Granted Jul 29, 2003·42 cites·9 claims
- 1276US6753251B2Method for filling recessed micro-structures with metallization in the production of a microelectronic deviceSEMITOOL INC·Filed 2002·Granted Jun 22, 2004·14 cites·43 claims
- 1375US6358388B1Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric coverSEMITOOL INC·Filed 1999·Granted Mar 19, 2002·35 cites·33 claims
- 1473US7229543B2Apparatus for controlling and/or measuring additive concentration in an electroplating bathSEMITOOL INC·Filed 2003·Granted Jun 12, 2007·8 cites·32 claims
- 1572US6663762B2Plating system workpiece support having workpiece engaging electrodeSEMITOOL INC·Filed 2002·Granted Dec 16, 2003·11 cites·35 claims
- 1669US11824317B2Wire nut electrical connectorGRAHAM LYNDON·Filed 2021·Granted Nov 21, 2023·1 cites·7 claims
- 1767US7144805B2Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current densitySEMITOOL INC·Filed 2004·Granted Dec 5, 2006·8 cites·29 claims
- 1863US6899805B2Automated chemical management system executing improved electrolyte analysis methodSEMITOOL INC·Filed 2001·Granted May 31, 2005·4 cites·26 claims
- 1962US7244677B2Method for filling recessed micro-structures with metallization in the production of a microelectronic deviceSEMITOOL INC·Filed 1998·Granted Jul 17, 2007·16 cites·30 claims
- 2062US2024039175A1Wire Nut Electrical ConnectorGRAHAM LYNDON·Filed 2023·Application pending·0 cites
- 2160US6814855B2Automated chemical management system having improved analysis unitSEMITOOL INC·Filed 2001·Granted Nov 9, 2004·3 cites·26 claims
- 2259US7462269B2Method for low temperature annealing of metallization micro-structures in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Granted Dec 9, 2008·5 cites·33 claims
- 2359USRE38931EMethods for controlling and/or measuring additive concentration in an electroplating bathSEMITOOL INC·Filed 2003·Granted Jan 10, 2006·3 cites·68 claims
- 2455US2005000818A1Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpieceSEMITOOL INC·Filed 2004·Application pending·0 cites
- 2553US6994776B2Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Granted Feb 7, 2006·5 cites·6 claims
- 2652US2007114133A1Method for filling recessed micro-structures with metallization in the production of a microelectronic deviceSEMITOOL INC·Filed 2006·Application pending·0 cites
- 2752US2007215481A1In-situ cleaning processes for semiconductor electroplating electrodesGRAHAM LYNDON W·Filed 2007·Application pending·0 cites
- 2851US2006079085A1Method for applying metal features onto metallized layers using electrochemical depositionSEMITOOL INC·Filed 2005·Application pending·0 cites
- 2951US2006079083A1Method for applying metal features onto metallized layers using electrochemical deposition using acid treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 3051US2006208272A1Method for filling recessed micro-structures with metallization in the production of a microelectronic deviceSEMITOOL INC·Filed 2006·Application pending·0 cites
- 3151US2006079084A1Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 3251US2006084264A1Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 3345US2001045356A1Methods and apparatus for controlling and/or measuring additive concentration in an electroplating bathFiled 2001·Application pending·0 cites
- 3443US2005061675A1Semiconductor plating system workpiece support having workpiece-engaging electrodes with distal contact part and dielectric coverFiled 2003·Application pending·0 cites
- 3542US2004108212A1Apparatus and methods for transferring heat during chemical processing of microelectronic workpiecesFiled 2002·Application pending·0 cites
- 3641US2003201190A1In-situ cleaning processes for semiconductor electroplating electrodesFiled 2003·Application pending·0 cites
- 3740US2003045095A1Method for filling recessed micro-structures with metallization in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Application pending·0 cites
- 3839US7001471B2Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic deviceSEMITOOL INC·Filed 1999·Granted Feb 21, 2006·5 cites·102 claims
- 3939US2002017456A1Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operationsFiled 2001·Application pending·0 cites
- 4037US2011173918A1Adjustable wall braceGRAHAM LYNDON·Filed 2010·Application pending·0 cites
- 4130US2002000380A1Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpieceFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →