Inventor · disambiguated record
Maniam Alagaratnam
Also filed as: ALAGARATNAM MANIAM · ALAGARATNAM MANIAM B
23 granted patents·1 pending application·1,409 citations·filing 1993–2004
97Inventor score
Files withLSI LOGIC CORP23
Top patents by PatentIndex Score
24 records- 0197US6335491B1Interposer for semiconductor package assemblyLSI LOGIC CORP·Filed 2000·Granted Jan 1, 2002·129 cites·18 claims
- 0296US5814881AStacked integrated chip package and method of making sameLSI LOGIC CORP·Filed 1996·Granted Sep 29, 1998·229 cites·23 claims
- 0395US6081997ASystem and method for packaging an integrated circuit using encapsulant injectionLSI LOGIC CORP·Filed 1997·Granted Jul 4, 2000·202 cites·21 claims
- 0494US6608376B1Integrated circuit package substrate with high density routing mechanismLSI LOGIC CORP·Filed 2002·Granted Aug 19, 2003·81 cites·21 claims
- 0594US5886398AMolded laminate package with integral mold gateLSI LOGIC CORP·Filed 1997·Granted Mar 23, 1999·184 cites·20 claims
- 0690US6225695B1Grooved semiconductor die for flip-chip heat sink attachmentLSI LOGIC CORP·Filed 1997·Granted May 1, 2001·123 cites·16 claims
- 0786US7119432B2Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor packageLSI LOGIC CORP·Filed 2004·Granted Oct 10, 2006·42 cites·15 claims
- 0886US6618938B1Interposer for semiconductor package assemblyLSI LOGIC CORP·Filed 2001·Granted Sep 16, 2003·31 cites·18 claims
- 0986US5923047ASemiconductor die having sacrificial bond pads for die testLSI LOGIC CORP·Filed 1997·Granted Jul 13, 1999·78 cites·3 claims
- 1080US5841191ABall grid array package employing raised metal contact ringsLSI LOGIC CORP·Filed 1997·Granted Nov 24, 1998·58 cites·12 claims
- 1180US5744084AMethod of improving molding of an overmolded package body on a substrateLSI LOGIC CORP·Filed 1995·Granted Apr 28, 1998·54 cites·4 claims
- 1275US6586825B1Dual chip in package with a wire bonded die mounted to a substrateLSI LOGIC CORP·Filed 2001·Granted Jul 1, 2003·23 cites·37 claims
- 1372US5869889AThin power tape ball grid array packageLSI LOGIC CORP·Filed 1997·Granted Feb 9, 1999·43 cites·4 claims
- 1465US5927505AOvermolded package body on a substrateLSI LOGIC CORP·Filed 1997·Granted Jul 27, 1999·26 cites·4 claims
- 1565US5841198ABall grid array package employing solid core solder ballsLSI LOGIC CORP·Filed 1997·Granted Nov 24, 1998·32 cites·6 claims
- 1662US6433565B1Test fixture for flip chip ball grid array circuitsLSI LOGIC CORP·Filed 2001·Granted Aug 13, 2002·10 cites·7 claims
- 1760US7041516B2Multi chip module assemblyLSI LOGIC CORP·Filed 2002·Granted May 9, 2006·7 cites·19 claims
- 1857US6429534B1Interposer tape for semiconductor packageLSI LOGIC CORP·Filed 2000·Granted Aug 6, 2002·7 cites·20 claims
- 1950US6297550B1Bondable anodized aluminum heatspreader for semiconductor packagesLSI LOGIC CORP·Filed 1998·Granted Oct 2, 2001·16 cites·15 claims
- 2046US6777314B2Method of forming electrolytic contact pads including layers of copper, nickel, and goldLSI LOGIC CORP·Filed 2002·Granted Aug 17, 2004·1 cites·4 claims
- 2146US6057594AHigh power dissipating tape ball grid array packageLSI LOGIC CORP·Filed 1997·Granted May 2, 2000·13 cites·15 claims
- 2242US5386144ASnap on heat sink attachmentLSI LOGIC CORP·Filed 1993·Granted Jan 31, 1995·14 cites·10 claims
- 2337US2004178498A1Wire bonding to full array bonding pads on active circuitryFiled 2003·Application pending·0 cites
- 2436US6110815AElectroplating fixture for high density substratesLSI LOGIC CORP·Filed 1998·Granted Aug 29, 2000·6 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →