Inventor · disambiguated record
Manuel Aldrete
Also filed as: ALDRETE MANUEL
15 granted patents·31 pending applications·31 citations·filing 2012–2024
88Inventor score
Files withQUALCOMM INC46
Top patents by PatentIndex Score
46 records- 0192US10325855B2Backside drill embedded die substrateQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·10 cites·28 claims
- 0282US10431511B2Power amplifier with RF structureQUALCOMM INC·Filed 2017·Granted Oct 1, 2019·4 cites·31 claims
- 0377US9269681B2Surface finish on trace for a thermal compression flip chip (TCFC)QUALCOMM INC·Filed 2013·Granted Feb 23, 2016·4 cites·7 claims
- 0476US10418333B1Waveguide along shielded side wallQUALCOMM INC·Filed 2018·Granted Sep 17, 2019·2 cites·15 claims
- 0574US10511268B2Segmented thermal and RF groundQUALCOMM INC·Filed 2017·Granted Dec 17, 2019·2 cites·30 claims
- 0673US9466578B2Substrate comprising improved via pad placement in bump areaQUALCOMM INC·Filed 2014·Granted Oct 11, 2016·3 cites·28 claims
- 0770US8802556B2Barrier layer on bump and non-wettable coating on traceQUALCOMM INC·Filed 2013·Granted Aug 12, 2014·2 cites·20 claims
- 0869US10325859B1Shielded stacked substrate apparatus and method of fabricatingQUALCOMM INC·Filed 2018·Granted Jun 18, 2019·1 cites·13 claims
- 0968US9313881B2Through mold via relief gutter on molded laser package (MLP) packagesQUALCOMM INC·Filed 2013·Granted Apr 12, 2016·3 cites·32 claims
- 1062US2025372479A1Package comprising an integrated device, a substrate and a heat sinkQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1162US2025379135A1Package comprising an integrated device and an offset memory deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1261US2025316575A1Die-first metallization structure and substrate interposer hybrid packageQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1361US2025273585A1Package comprising substrates and integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1461US2025372543A1Package comprising a trench capacitor device with a metallization portion comprising bar metallization interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1560US2025273626A1Package comprising integrated devices and an interconnection deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1660US2025259919A1Package comprising a substrate and a passive deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1759US2025293130A1Die package with entangled vertical interconnects coupled to a routing substrate for reduced routing substrate layers, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1859US2025246532A1Substrates including raised interconnects disposed on a die-side surface to support increased interconnect density and related methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1959US2025357238A1Package including substrates, integrated devices, and heat slugQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2059US2025273612A1Package comprising a substrate including an inter substrate interconnect structure comprising an inner interconnectQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2159US2025125244A1Interposer connection structures based on wire bondingQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2258US12463127B2Integrated circuit (IC) package employing a re-distribution layer (RDL) substrate(s) with photosensitive dielectric layer(s) for increased package rigidity, and related fabrication methodsQUALCOMM INC·Filed 2023·Granted Nov 4, 2025·0 cites·21 claims
- 2358US2025079277A1Integrated circuit device having a substrate with a stepped configuration to accommodate at least two different solder ball sizesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2458US2025046688A1Integrated device including direct memory attachment on through mold conductorsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2558US2025218966A1Substrate having asymmetric metallization structures disposed on opposite sides of a central coreQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2658US2025192010A1Interposer substrate including offset core layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2758US2025096051A1Package comprising a substrate with cavity, and an integrated device located in the cavity of the substrateQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2857US2025125234A1Interposer connection structures based on wire bondingQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2957US2025379134A1Integrated circuit package comprising a substrate and a solder joint coupled to a corner interconnect structure of the substrate to improve the reliability of the packageQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3055US2025070086A1Package-on-package device including redistribution dieQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3154US2025293211A1Heat dissipation for stacked integrated circuit devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3252US2014322868A1Barrier layer on bump and non-wettable coating on traceQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3351US11804428B2Mixed pad size and pad designQUALCOMM INC·Filed 2020·Granted Oct 31, 2023·0 cites·22 claims
- 3451US2023369230A1Package comprising an interconnection die located between metallization portionsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3547US10879191B2Conformal shielding for solder ball arrayQUALCOMM INC·Filed 2019·Granted Dec 29, 2020·0 cites·19 claims
- 3644US2015206812A1Substrate and method of forming the sameQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3743US10490472B2Air cavity moldQUALCOMM INC·Filed 2017·Granted Nov 26, 2019·0 cites·26 claims
- 3842US2021280507A1Package comprising dummy interconnectsQUALCOMM INC·Filed 2020·Application pending·0 cites
- 3942US2014175658A1Anchoring a trace on a substrate to reduce peeling of the traceQUALCOMM INC·Filed 2013·Application pending·0 cites
- 4042US2014159238A1Package having thermal compression flip chip (tcfc) and chip with reflow bonding on leadQUALCOMM INC·Filed 2012·Application pending·0 cites
- 4141US9768108B2Conductive post protection for integrated circuit packagesQUALCOMM INC·Filed 2015·Granted Sep 19, 2017·0 cites·26 claims
- 4239US2019341352A1Tapered corner package for emi shieldQUALCOMM INC·Filed 2018·Application pending·0 cites
- 4338US10319694B2Semiconductor assembly and method of making sameQUALCOMM INC·Filed 2016·Granted Jun 11, 2019·0 cites·21 claims
- 4436US2018228016A1Wire-bond cage in conformal shieldingQUALCOMM INC·Filed 2017·Application pending·0 cites
- 4535US2017084523A1On-package connectorQUALCOMM INC·Filed 2015·Application pending·0 cites
- 4633US2016148864A1Integrated device package comprising heterogeneous solder joint structureQUALCOMM INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →