Inventor · disambiguated record
Masatsugu Amishiro
Also filed as: AMISHIRO MASATSUGU
9 granted patents·4 pending applications·160 citations·filing 1999–2013
88Inventor score
Top patents by PatentIndex Score
13 records- 0186US7102388B2Interface device and information processing systemHITACHI LTD·Filed 2003·Granted Sep 5, 2006·30 cites·8 claims
- 0278US6603807B1Isolator and a modem device using the isolatorHITACHI LTD·Filed 1999·Granted Aug 5, 2003·85 cites·17 claims
- 0376US8203210B2Semiconductor device having metal contacts formed in an interlayer dielectric film comprising four silicon-containing layersFURUSAWA TAKESHI·Filed 2010·Granted Jun 19, 2012·4 cites·25 claims
- 0474US7522692B2Isolator and a modem device using the isolatorHITACHI LTD·Filed 2007·Granted Apr 21, 2009·4 cites·2 claims
- 0571US6977522B1Interface device and information processing systemHITACHI LTD·Filed 1999·Granted Dec 20, 2005·30 cites·10 claims
- 0663US7289553B2Isolator and a modem device using the isolatorHITACHI LTD·Filed 2003·Granted Oct 30, 2007·6 cites·19 claims
- 0761US7759975B2Interface device and information processing systemHITACHI LTD·Filed 2008·Granted Jul 20, 2010·1 cites·11 claims
- 0850US2009184424A1Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 0949US7479804B2Interface device and information processing systemHITACHI LTD·Filed 2006·Granted Jan 20, 2009·0 cites·5 claims
- 1048US2013241067A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1148US2008230847A1Semiconductor device and manufacturing method of the sameFURUSAWA TAKESHI·Filed 2008·Application pending·0 cites
- 1247US2012289032A1Semiconductor device and manufacturing method of the sameFURUSAWA TAKESHI·Filed 2012·Application pending·0 cites
- 1336US6563200B2Interface device and interface systemHITACHI LTD·Filed 2001·Granted May 13, 2003·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →