Inventor · disambiguated record
Mahesh Bohra
Also filed as: BOHRA MAHESH
11 granted patents·1 pending application·8 citations·filing 2009–2022
83Inventor score
Top patents by PatentIndex Score
12 records- 0182US8389870B2Coreless multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2010·Granted Mar 5, 2013·6 cites·2 claims
- 0256US9374910B2Printed circuit board copper plane repairIBM·Filed 2013·Granted Jun 21, 2016·0 cites·11 claims
- 0355US8358509B2Reduced wiring requirements with signal slope manipulationIBM·Filed 2009·Granted Jan 22, 2013·2 cites·29 claims
- 0454US9548769B2Reduced wiring requirements with signal slope manipulationIBM·Filed 2014·Granted Jan 17, 2017·0 cites·29 claims
- 0552US9773725B2Coreless multi-layer circuit substrate with minimized pad capacitanceIBM·Filed 2015·Granted Sep 26, 2017·0 cites·10 claims
- 0651US9980382B2Method of making a printed circuit board copper plane repairIBM·Filed 2015·Granted May 22, 2018·0 cites·3 claims
- 0751US8975525B2Corles multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2012·Granted Mar 10, 2015·0 cites·3 claims
- 0851US2024008186A1Real-time control of via stub drilling depth asymmetryIBM·Filed 2022·Application pending·0 cites
- 0948US9060428B2Coreless multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2012·Granted Jun 16, 2015·0 cites·2 claims
- 1046US9485866B2Printed circuit board copper plane repairIBM·Filed 2016·Granted Nov 1, 2016·0 cites·1 claims
- 1145US8743558B2Reduced wiring requirements with signal slope manipulationBILLS KEVIN J·Filed 2012·Granted Jun 3, 2014·0 cites·25 claims
- 1232US8593621B2Testing an optical fiber connectionBILLS KEVIN J·Filed 2010·Granted Nov 26, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →