Inventor · disambiguated record
Maryse Cournoyer
Also filed as: COURNOYER MARYSE
7 granted patents·50 citations·filing 2017–2021
80Inventor score
Files withIBM7
Top patents by PatentIndex Score
7 records- 0192US10784202B2High-density chip-to-chip interconnection with silicon bridgeIBM·Filed 2017·Granted Sep 22, 2020·33 cites·15 claims
- 0291US11209598B2Photonics package with face-to-face bondingIBM·Filed 2019·Granted Dec 28, 2021·11 cites·19 claims
- 0387US10580738B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 0479US10991635B2Multiple chip bridge connectorIBM·Filed 2019·Granted Apr 27, 2021·2 cites·20 claims
- 0560US11177217B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2020·Granted Nov 16, 2021·0 cites·7 claims
- 0654US11791270B2Direct bonded heterogeneous integration silicon bridgeIBM·Filed 2021·Granted Oct 17, 2023·0 cites·17 claims
- 0749US11139269B2Mixed under bump metallurgy (UBM) interconnect bridge structureIBM·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →