Inventor · disambiguated record
Masatoshi Deguchi
Also filed as: DEGUCHI MASATOSHI
17 granted patents·7 pending applications·658 citations·filing 1994–2023
95Inventor score
Top patents by PatentIndex Score
24 records- 0194US5658615AMethod of forming coating film and apparatus thereforTOKYO ELECTRON LTD·Filed 1994·Granted Aug 19, 1997·187 cites·23 claims
- 0290US6063190AMethod of forming coating film and apparatus thereforTOKYO ELECTRON LTD·Filed 1999·Granted May 16, 2000·94 cites·7 claims
- 0390US5942035ASolvent and resist spin coating apparatusTOKYO ELECTRON LTD·Filed 1996·Granted Aug 24, 1999·103 cites·13 claims
- 0487US5580607ACoating apparatus and methodTOKYO ELECTRON LTD·Filed 1994·Granted Dec 3, 1996·104 cites·4 claims
- 0586US8899289B2Joint method, joint apparatus and joint systemDEGUCHI MASATOSHI·Filed 2012·Granted Dec 2, 2014·9 cites·15 claims
- 0683US6281145B1Apparatus and method for applying process solutionTOKYO ELECTRON LTD·Filed 1999·Granted Aug 28, 2001·62 cites·12 claims
- 0782US6466300B1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Oct 15, 2002·30 cites·19 claims
- 0879US6473151B1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Oct 29, 2002·24 cites·14 claims
- 0975US8846495B2Bonding system and bonding methodTOKYO ELECTRON LTD·Filed 2013·Granted Sep 30, 2014·3 cites·18 claims
- 1075US6821550B2Apparatus and method for applying process solutionTOKYO ELECTRON LTD·Filed 2001·Granted Nov 23, 2004·16 cites·11 claims
- 1174US9484236B2Joining method and joining systemOKADA SHINJI·Filed 2012·Granted Nov 1, 2016·3 cites·5 claims
- 1274US6659661B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2002·Granted Dec 9, 2003·18 cites·11 claims
- 1365US7517217B2Method and apparatus for heat processing of substrateTOKYO ELECTRON LTD·Filed 2005·Granted Apr 14, 2009·2 cites·3 claims
- 1460US8707893B2Substrate treatment system, substrate treatment method, and non-transitory computer storage mediumDEGUCHI MASATOSHI·Filed 2011·Granted Apr 29, 2014·2 cites·18 claims
- 1557US2024393671A1Information processing system and method and non-transitory computer readable mediumFUJIFILM BUSINESS INNOVATION CORP·Filed 2023·Application pending·0 cites
- 1655US2024393998A1Booth apparatusFUJIFILM BUSINESS INNOVATION CORP·Filed 2023·Application pending·0 cites
- 1748US2014284000A1Separation apparatus, separation system, separation method and non-transitory computer readable storage mediumTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 1845US6969538B2Method for heat processing of substrateTOKYO ELECTRON LTD·Filed 2001·Granted Nov 29, 2005·1 cites·8 claims
- 1944US9463612B2Joining method and joining systemOKADA SHINJI·Filed 2012·Granted Oct 11, 2016·0 cites·9 claims
- 2044US2013000684A1Cleaning method and cleaning apparatusTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 2142US2014251546A1Peeling device, peeling system and peeling methodTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 2241US10008419B2Separation method, computer storage medium, and separation systemOKADA SHINJI·Filed 2012·Granted Jun 26, 2018·0 cites·11 claims
- 2338US2013062013A1Joint apparatus, joint system, and joint methodOKADA SHINJI·Filed 2012·Application pending·0 cites
- 2432US2015251398A1Bonding system and bonding methodTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →