Inventor · disambiguated record
Matteo De Santa
Also filed as: DE SANTA MATTEO
6 granted patents·4 pending applications·3 citations·filing 2016–2025
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0171US10872845B2Process for manufacturing a flip chip semiconductor package and a corresponding flip chip packageST MICROELECTRONICS SRL·Filed 2018·Granted Dec 22, 2020·2 cites·14 claims
- 0268US2024266259A1Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and toolST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 0362US11967544B2Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and toolST MICROELECTRONICS SRL·Filed 2021·Granted Apr 23, 2024·0 cites·14 claims
- 0462US10141197B2Thermosonically bonded connection for flip chip packagesST MICROELECTRONICS SRL·Filed 2016·Granted Nov 27, 2018·1 cites·21 claims
- 0558US2025079386A1Method of manufacturing semiconductor devices, corresponding component and semiconductor deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0654US2024145351A1Method of manufacturing semiconductor devices, corresponding semiconductor device, assembly and support substrateST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 0753US12406909B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Sep 2, 2025·0 cites·12 claims
- 0850US10741415B2Thermosonically bonded connection for flip chip packagesST MICROELECTRONICS SRL·Filed 2018·Granted Aug 11, 2020·0 cites·19 claims
- 0949US12506053B2Method of assembling semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Dec 23, 2025·0 cites·22 claims
- 1046US2025300126A1Method of manufacturing semiconductor devices and corresponding deviceST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →