Inventor · disambiguated record
Mark L. Diorio
Also filed as: DIORIO MARK L
7 granted patents·3 pending applications·211 citations·filing 1989–2007
88Inventor score
Top patents by PatentIndex Score
10 records- 0195US7144759B1Technology partitioning for advanced flip-chip packagingCELERITY RES PTE LTD·Filed 2005·Granted Dec 5, 2006·71 cites·17 claims
- 0279US6975127B2Planarizing and testing of BGA packagesCELERITY RES INC·Filed 2003·Granted Dec 13, 2005·17 cites·21 claims
- 0378US5008734AStadium-stepped package for an integrated circuit with air dielectricNAT SEMICONDUCTOR CORP·Filed 1989·Granted Apr 16, 1991·55 cites·16 claims
- 0465US6984996B2Wafer probing that conditions devices for flip-chip bondingCELERITY RES INC·Filed 2003·Granted Jan 10, 2006·8 cites·10 claims
- 0560US5146310AThermally enhanced leadframeNAT SEMICONDUCTOR CORP·Filed 1991·Granted Sep 8, 1992·29 cites·6 claims
- 0658US5159750AMethod of connecting an IC component with another electrical componentNAT SEMICONDUCTOR CORP·Filed 1991·Granted Nov 3, 1992·30 cites·9 claims
- 0741US2005231222A1Wafer probing that conditions devices for flip-chip bondingDIORIO MARK L·Filed 2005·Application pending·0 cites
- 0836US7405581B2Probing system uses a probe device including probe tips on a surface of a semiconductor dieNOVELLUS DEV COMPANY LLC·Filed 2003·Granted Jul 29, 2008·1 cites·14 claims
- 0930US2005289415A1Intelligent probe chips/headsCELERITY RES INC·Filed 2005·Application pending·0 cites
- 1029US2008079450A1Intelligent probe chips/headsDEAN VADA W·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →