Inventor · disambiguated record
Mark A. Dirocco
Also filed as: DIROCCO MARK A
4 granted patents·2 citations·filing 2013–2015
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0162US9658255B2Signal monitoring of through-wafer vias using a multi-layer inductorIBM·Filed 2015·Granted May 23, 2017·1 cites·20 claims
- 0255US9269642B2Methods for testing integrated circuits of wafer and testing structures for integrated circuitsGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 23, 2016·1 cites·13 claims
- 0352US9372208B2Signal monitoring of through-wafer vias using a multi-layer inductorIBM·Filed 2014·Granted Jun 21, 2016·0 cites·19 claims
- 0433US8937010B2Information encoding using wirebondsIBM·Filed 2013·Granted Jan 20, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →