Inventor · disambiguated record
Manish Dubey
Also filed as: DUBEY MANISH
19 granted patents·15 pending applications·23 citations·filing 2012–2025
91Inventor score
Top patents by PatentIndex Score
34 records- 0197US11302643B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2020·Granted Apr 12, 2022·5 cites·19 claims
- 0296US12176292B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2023·Granted Dec 24, 2024·2 cites·20 claims
- 0395US11817390B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0488US10651108B2Foam compositeINTEL CORP·Filed 2016·Granted May 12, 2020·4 cites·7 claims
- 0587US2025070030A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2024·Application pending·0 cites
- 0683US2025226323A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2025·Application pending·0 cites
- 0777US11640942B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 0873US10535615B2Electronic package that includes multi-layer stiffenerINTEL CORP·Filed 2016·Granted Jan 14, 2020·2 cites·14 claims
- 0972US9721906B2Electronic package with corner supportsINTEL CORP·Filed 2015·Granted Aug 1, 2017·2 cites·12 claims
- 1068US9431274B2Method for reducing underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2012·Granted Aug 30, 2016·2 cites·7 claims
- 1166US9887104B2Electronic package and method of connecting a first die to a second die to form an electronic packageINTEL CORP·Filed 2014·Granted Feb 6, 2018·2 cites·7 claims
- 1265US11670569B2Channeled lids for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jun 6, 2023·1 cites·22 claims
- 1362US8999765B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2013·Granted Apr 7, 2015·1 cites·16 claims
- 1460US2025372919A1Connector assembly with magnetic guidesADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1557US2025079276A1Stiffener with integrated connectorsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1656US2024332098A1Lid assembly for a chip packageADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1753US2025246580A1Integrated circuit die stack with a bridge dieADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1853US2025246519A1Integrated circuit die stack with a dual-sided bridge dieADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1952US12176268B2Open cavity bridge co-planar placement architectures and processesINTEL CORP·Filed 2020·Granted Dec 24, 2024·0 cites·6 claims
- 2052US2025118706A1Chip package with a thermal carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 2152US2025167192A1Integrated circuit die stack with a bridge dieADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 2251US11887962B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Jan 30, 2024·0 cites·7 claims
- 2351US11798861B2Integrated heat spreader (IHS) with heating elementINTEL CORP·Filed 2019·Granted Oct 24, 2023·0 cites·20 claims
- 2451US11791274B2Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnectsINTEL CORP·Filed 2020·Granted Oct 17, 2023·0 cites·17 claims
- 2547US11545407B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 3, 2023·0 cites·20 claims
- 2647US9230833B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2015·Granted Jan 5, 2016·0 cites·16 claims
- 2746US2022199503A1Novel lga architecture for improving reliability performance of metal defined padsINTEL CORP·Filed 2020·Application pending·0 cites
- 2845US2016343591A1Reduction of underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 2942US2021020537A1Integrated heat spreader (ihs) with solder thermal interface material (stim) bleed-out restricting featureINTEL CORP·Filed 2019·Application pending·0 cites
- 3041US2020411407A1Integrated circuit packages with solder thermal interface materialINTEL CORP·Filed 2019·Application pending·0 cites
- 3139US10206277B2Gradient encapsulant protection of devices in stretchable electronicsINTEL CORP·Filed 2015·Granted Feb 12, 2019·0 cites·15 claims
- 3239US2020006273A1Microelectronic device interconnect structureINTEL CORP·Filed 2018·Application pending·0 cites
- 3337US2017018525A1Method and process for emib chip interconnectionsINTEL CORP·Filed 2014·Application pending·0 cites
- 3434US9508660B2Microelectronic die having chamfered cornersINTEL CORP·Filed 2015·Granted Nov 29, 2016·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →