Inventor · disambiguated record
Mark Eblen
Also filed as: EBLEN MARK
4 granted patents·1 pending application·8 citations·filing 2015–2021
65Inventor score
Top patents by PatentIndex Score
5 records- 0190US11424053B1Ceramic feedthrough assemblies for electronic devices with metal housingsKYOCERA INT INC·Filed 2021·Granted Aug 23, 2022·2 cites·21 claims
- 0285US9859185B2Semiconductor packaging structure and package having stress release structureKYOCERA INT INC·Filed 2017·Granted Jan 2, 2018·5 cites·17 claims
- 0355US9331000B2Heat management in electronics packagingKYOCERA AMERICA INC·Filed 2015·Granted May 3, 2016·1 cites·10 claims
- 0443US10410959B2Lead package and method for minimizing deflection in microelectronic packagingKYOCERA INT INC·Filed 2018·Granted Sep 10, 2019·0 cites·20 claims
- 0536US2019006254A1Microelectronic package construction enabled through ceramic insulator strengthening and designKYOCERA INT INC·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mark Eblen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →