Inventor · disambiguated record
Masahiko Furuno
Also filed as: FURUNO MASAHIKO
4 granted patents·3 pending applications·40 citations·filing 2002–2006
73Inventor score
Top patents by PatentIndex Score
7 records- 0182US6742701B2Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatusTAMURA SEISAKUSHO KK·Filed 2002·Granted Jun 1, 2004·26 cites·31 claims
- 0274US8042727B2Heater, reflow apparatus, and solder bump forming method and apparatusTAMURA SEISAKUSHO KK·Filed 2005·Granted Oct 25, 2011·10 cites·6 claims
- 0349US7350686B2Method for supplying solderTAMURA SEISAKUSHO KK·Filed 2002·Granted Apr 1, 2008·4 cites·8 claims
- 0444US2008035710A1Solder Composition and Solder Layer Forming Method Using the SameTAMURA SEISAKUSHO KK·Filed 2005·Application pending·0 cites
- 0540US2004238602A1Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatusTAMURA SEISAKUSHO KK·Filed 2004·Application pending·0 cites
- 0634US2007181218A1Solder composition and method of bump formation therewithJAPAN SCIENCE & TECH AGENCY·Filed 2005·Application pending·0 cites
- 0733US8104661B2Heating device, reflow device, heating method, and bump forming methodONOZAKI JUNICHI·Filed 2006·Granted Jan 31, 2012·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →