Inventor · disambiguated record
Marco Gavagnin
Also filed as: GAVAGNIN MARCO
17 granted patents·10 pending applications·6 citations·filing 2016–2025
86Inventor score
Top patents by PatentIndex Score
27 records- 0189US11450587B2Heat removal mechanism for stack-based electronic device with process control component and processing componentsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Sep 20, 2022·2 cites·15 claims
- 0281US2025349688A1Component Carrier With Photoimageable Dielectric Layer and Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic RadiationAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
- 0379US11430703B2Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummiesAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Aug 30, 2022·1 cites·8 claims
- 0470US10368448B2Method of manufacturing a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2017·Granted Jul 30, 2019·1 cites·16 claims
- 0569US12381138B2Component carrier with a photoimageable dielectric layer and a structured conductive layer being used as a mask for selectively exposing the photoimageable dielectric layer with electromagnetic radiationAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Aug 5, 2025·0 cites·15 claims
- 0666US11058007B2Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portionsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jul 6, 2021·1 cites·13 claims
- 0762US11682600B2Protection layer for panel handling systemsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jun 20, 2023·1 cites·21 claims
- 0862US2023249252A1Metal Body Formed on a Component Carrier by Additive ManufacturingAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 0960US2025081350A1Component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Application pending·0 cites
- 1058US11051406B2Component carrier with integrated inductor and manufacturing methodAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jun 29, 2021·0 cites·20 claims
- 1157US10782259B2Determining a physical quantity with a native component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Sep 22, 2020·0 cites·14 claims
- 1257US2025070005A1Ic substrate having central section with vertically stacked functional volume sectionsAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 1356US11388824B2Component carrier having a three dimensionally printed wiring structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jul 12, 2022·0 cites·16 claims
- 1456US2025038117A1Ic substrate with support structure and functional inlays thereinAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 1555US11184983B2Embedding known-good component between known-good component carrier blocks with late formed electric connection structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Nov 23, 2021·0 cites·16 claims
- 1654US11366181B2Component carrier with integrated flux gate sensorAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jun 21, 2022·0 cites·17 claims
- 1753US12262482B2Method of manufacturing component carrier and component carrier intermediate productAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Mar 25, 2025·0 cites·11 claims
- 1853US2023319989A1Component CarrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1952US11197367B2Component carrier comprising a double layer structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 7, 2021·0 cites·9 claims
- 2050US2020083154A1Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic RadiationAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Application pending·0 cites
- 2148US12471203B2Interconnection of printed circuit boards with nanowiresAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Granted Nov 11, 2025·0 cites·15 claims
- 2247US2022190464A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an AntennaAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Application pending·0 cites
- 2346US11659648B2Metal body formed on a component carrier by additive manufacturingAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted May 23, 2023·0 cites·15 claims
- 2445US10790234B2Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Sep 29, 2020·0 cites·10 claims
- 2541US10905016B2Using a partially uncured component carrier body for manufacturing component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2016·Granted Jan 26, 2021·0 cites·20 claims
- 2640US2019110366A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Application pending·0 cites
- 2737US2018213647A1Solid-State Transition Piece Being Transferable Into an Adhesive State for Embedding a Component in a Component CarrierAUSTRIA TECH & SYSTEM TECH·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →