Inventor · disambiguated record
Martin Gruber
Also filed as: GRUBER MARTIN · GRUBER MARTIN A · GRUBER MARTIN GRUBER
52 granted patents·10 pending applications·93 citations·filing 1979–2024
97Inventor score
Files withINFINEON TECHNOLOGIES AG33INFINEON TECHNOLOGIES AUSTRIA AG19AUDI AG2DAIMLER AG2ALPINE DRIVE GMBH1
Top patents by PatentIndex Score
62 records- 0191US11728250B2Semiconductor package with connection lugINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
- 0291US10418313B2Electronic module comprising a plurality of encapsulation layers and a method for producing itINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Sep 17, 2019·9 cites·14 claims
- 0389US10629575B1Stacked die semiconductor package with electrical interposerINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 21, 2020·6 cites·20 claims
- 0487US11600558B2Plurality of transistor packages with exposed source and drain contacts mounted on a carrierINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 7, 2023·2 cites·14 claims
- 0580US12394697B2Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screwINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Aug 19, 2025·0 cites·13 claims
- 0679US12438063B2Electronic module including a semiconductor package disposed on an interposer layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0779US11721616B2Semiconductor package with signal distribution elementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Aug 8, 2023·1 cites·19 claims
- 0877US12463116B2Method for fabricating a semiconductor device including an embedded semiconductor dieINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0977USD258123SRingGRUBER MARTIN·Filed 1979·Granted Feb 3, 1981·15 cites·1 claims
- 1076US9564578B2Semiconductor package with integrated magnetic field sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 7, 2017·3 cites·20 claims
- 1176US7707998B2Internal combustion engine and method for operating an internal combustion engineAUDI AG·Filed 2007·Granted May 4, 2010·8 cites·12 claims
- 1275US12261146B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Mar 25, 2025·0 cites·12 claims
- 1374US10153766B2Switch deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Dec 11, 2018·2 cites·20 claims
- 1474US10062671B2Circuit board embedding a power semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 28, 2018·2 cites·13 claims
- 1573US11915999B2Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling elementINFINEON TECHNOLOGIES AG·Filed 2023·Granted Feb 27, 2024·0 cites·20 claims
- 1673US10014275B2Method for producing a chip assemblageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 3, 2018·2 cites·19 claims
- 1773US7971576B2Internal combustion engine and method for operating an internal combustion engineAUDI AG·Filed 2007·Granted Jul 5, 2011·7 cites·14 claims
- 1872US2025125218A1Electronic module having a clip connected to a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1972US2025054843A1Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing MethodINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2071US2024113026A1Silicon Carbide Device and Method for Forming a Silicon Carbide DeviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2170US10971457B2Semiconductor device comprising a composite material clipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 6, 2021·1 cites·20 claims
- 2269US11955415B2Semiconductor device package comprising a pin in the form of a drilling screwINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Apr 9, 2024·0 cites·10 claims
- 2369US10886186B2Semiconductor package systemINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·24 claims
- 2469US6489675B1Optical semiconductor component with an optically transparent protective layerINFINEON TECHNOLOGIES AG·Filed 2000·Granted Dec 3, 2002·22 cites·11 claims
- 2568US6564583B2Jewelry with girdle-grooved stoneFiled 2001·Granted May 20, 2003·7 cites·27 claims
- 2667US10373895B2Semiconductor device having die pads with exposed surfacesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·1 cites·20 claims
- 2766US11955407B2Electronic module including a semiconductor package connected to a fluid heatsinkINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Apr 9, 2024·0 cites·19 claims
- 2865US10037972B2Electronic module comprising fluid cooling channel and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 31, 2018·1 cites·13 claims
- 2964US12165959B2Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 10, 2024·0 cites·8 claims
- 3064US12002739B2Semiconductor device including an embedded semiconductor dieINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Jun 4, 2024·0 cites·18 claims
- 3164US11715719B2Semiconductor package and method of forming a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 1, 2023·0 cites·23 claims
- 3262US2023051100A1Semiconductor package having a lead frame and a clip frameINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3361US10168391B2Multi-functional interconnect module and carrier with multi-functional interconnect module attached theretoINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 1, 2019·1 cites·25 claims
- 3461US2004172307A1Electronic medical record methodFiled 2004·Application pending·0 cites
- 3560US12080669B2Semiconductor device module having vertical metallic contacts and a method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 3659US12218030B2Electronic module comprising a semiconductor package with integrated clip and fastening elementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Feb 4, 2025·0 cites·2 claims
- 3758US11688713B2Additive manufacturing of a frontside or backside interconnect of a semiconductor dieINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Jun 27, 2023·0 cites·13 claims
- 3857US12218029B2Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chipsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Feb 4, 2025·0 cites·14 claims
- 3956US11862582B2Package with elevated lead and structure extending vertically from encapsulant bottomINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·0 cites·16 claims
- 4055US11515244B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 29, 2022·0 cites·11 claims
- 4154US12154886B2Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 26, 2024·0 cites·9 claims
- 4253US11502042B2Processing of one or more carrier bodies and electronic components by multiple alignmentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 15, 2022·0 cites·16 claims
- 4353US9123735B2Semiconductor device with combined passive device on chip back sideINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Sep 1, 2015·0 cites·16 claims
- 4452US11710684B2Package with separate substrate sectionsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 25, 2023·0 cites·18 claims
- 4552US11367683B2Silicon carbide device and method for forming a silicon carbide deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 21, 2022·0 cites·25 claims
- 4652US10964628B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 30, 2021·0 cites·12 claims
- 4751US11264356B2Batch manufacture of packages by sheet separated into carriers after mounting of electronic componentsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 1, 2022·0 cites·21 claims
- 4851US2011097633A1Fuel Cell System and Motor Vehicle with Such a Fuel Cell SystemDAIMLER AG·Filed 2009·Application pending·0 cites
- 4950US9524932B2Semiconductor device with combined passive device on chip back sideINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Dec 20, 2016·0 cites·17 claims
- 5050US9140735B2Integration of current measurement in wiring structure of an electronic circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →