Inventor · disambiguated record
Masao Hayakawa
Also filed as: HAYAKAWA MASAO
16 granted patents·5 pending applications·626 citations·filing 1976–2020
94Inventor score
Top patents by PatentIndex Score
21 records- 0196US4300153AFlat shaped semiconductor encapsulationSHARP KK·Filed 1980·Granted Nov 10, 1981·151 cites·12 claims
- 0293US4383363AMethod of making a through-hole connectorSHARP KK·Filed 1980·Granted May 17, 1983·135 cites·8 claims
- 0387US8932416B2High-strength and high-ductility die-quenched parts and method of manufacturing the sameNAKANISHI EIZABUROU·Filed 2010·Granted Jan 13, 2015·11 cites·9 claims
- 0487US5310699AMethod of manufacturing a bump electrodeSHARP KK·Filed 1992·Granted May 10, 1994·110 cites·12 claims
- 0586US4151543ALead electrode structure for a semiconductor chip carried on a flexible carrierSHARP KK·Filed 1977·Granted Apr 24, 1979·53 cites·8 claims
- 0677US6012474AMass flow control method and device utilizing a sonic nozzleHIRAI CO LTD·Filed 1997·Granted Jan 11, 2000·75 cites·13 claims
- 0775US4280132AMulti-lead frame member with means for limiting mold spreadSHARP KK·Filed 1979·Granted Jul 21, 1981·32 cites·6 claims
- 0864US2019099829A1Welding equipment for metallic materials and method for welding metallic materialsKANAI TAKAHIKO·Filed 2018·Application pending·0 cites
- 0961US9079266B2Welding equipment for metallic materials and method for welding metallic materialsKANAI TAKAHIKO·Filed 2009·Granted Jul 14, 2015·1 cites·13 claims
- 1056US10189112B2Welding equipment for metallic materials and method for welding metallic materialsKANAI TAKAHIKO·Filed 2015·Granted Jan 29, 2019·0 cites·12 claims
- 1155US4926239APlastic encapsulant for semiconductorSHARP KK·Filed 1989·Granted May 15, 1990·20 cites·9 claims
- 1251US4247590ACeramic plate for supporting a semiconductor waferSHARP KK·Filed 1977·Granted Jan 27, 1981·14 cites·5 claims
- 1349US12007299B2Reusability determination method for gear and reusability determination system for gearHITACHI CONSTRUCTION MACH CO·Filed 2020·Granted Jun 11, 2024·0 cites·3 claims
- 1448US2016299787A1System, method and managing deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
- 1546US4120041ASemiconductor device for use in an electronic apparatus having a plurality of circuit boardsSHARP KK·Filed 1976·Granted Oct 10, 1978·9 cites·7 claims
- 1641US9498840B2Welding structural part and welding method of the sameKANAI TAKAHIKO·Filed 2010·Granted Nov 22, 2016·0 cites·12 claims
- 1741US4536786ALead electrode connection in a semiconductor deviceSHARP KK·Filed 1979·Granted Aug 20, 1985·8 cites·9 claims
- 1837US2018024862A1Parallel processing system, method, and storage mediumFUJITSU LTD·Filed 2017·Application pending·0 cites
- 1936US2002157448A1Flowmeter calibration apparatusFiled 2001·Application pending·0 cites
- 2036US2011305595A1Hydrogen fatigue resistant ferritic steel and manufacturing method thereofMATSUOKA SABURO·Filed 2010·Application pending·0 cites
- 2130US4696452ATrip throttle valveEBARA CORP·Filed 1986·Granted Sep 29, 1987·7 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →