Inventor · disambiguated record
Markus Heinrici
Also filed as: HEINRICI MARKUS · Heinrici Markus Juch
12 granted patents·1 pending application·43 citations·filing 2014–2019
86Inventor score
Top patents by PatentIndex Score
13 records- 0194US9673096B2Method for processing a semiconductor substrate and a method for processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·22 cites·17 claims
- 0291US9844134B2Device including a metallization layer and method of manufacturing a deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 12, 2017·10 cites·21 claims
- 0384US9929111B2Method of manufacturing a layer structure having partially sealed poresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 27, 2018·4 cites·20 claims
- 0483US9620466B1Method of manufacturing an electronic device having a contact pad with partially sealed poresINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 11, 2017·4 cites·18 claims
- 0576US9190322B2Method for producing a copper layer on a semiconductor body using a printing processINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 17, 2015·3 cites·19 claims
- 0649US9793119B2Method for structuring a substrate using a protection layer as a maskINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 17, 2017·0 cites·17 claims
- 0747US9768023B1Method for structuring a substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Sep 19, 2017·0 cites·16 claims
- 0845US11195713B2Methods of forming a silicon-insulator layer and semiconductor device having the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 7, 2021·0 cites·15 claims
- 0944US10453806B2Methods for forming semiconductor devices and semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Oct 22, 2019·0 cites·17 claims
- 1039US10373868B2Method of processing a porous conductive structure in connection to an electronic component on a substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·0 cites·20 claims
- 1138US10967450B2Slicing SiC material by wire electrical discharge machiningINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 6, 2021·0 cites·20 claims
- 1237US9818602B2Method of depositing a resin material on a semiconductor body with an inkjet processINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Nov 14, 2017·0 cites·15 claims
- 1330US2016204017A1Embrittlement device, pick-up system and method of picking up chipsINFINEON TECHNOLOGIES AUSTRIA·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →