Inventor · disambiguated record
Masahiko Higashi
Also filed as: HIGASHI MASAHIKO
37 granted patents·26 pending applications·429 citations·filing 1995–2024
97Inventor score
Files withSPANSION LLC14KYOCERA CORP12HIGASHI MASAHIKO6TEXAS INSTRUMENTS INC6FUJITSU AMD SEMICONDUCTOR LTD4
Top patents by PatentIndex Score
63 records- 0196US7253046B2Semiconductor memory device and manufacturing method thereofSPANSION LLC·Filed 2005·Granted Aug 7, 2007·45 cites·17 claims
- 0295US7410857B2Semiconductor memory device and manufacturing method thereofSPANSION LLC·Filed 2007·Granted Aug 12, 2008·30 cites·11 claims
- 0391US10581426B1Source down power FET with integrated temperature sensorTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 3, 2020·8 cites·20 claims
- 0488US7250391B2Cleaning composition for removing resists and method of manufacturing semiconductor deviceEKC TECHNOLOGY K K·Filed 2003·Granted Jul 31, 2007·56 cites·9 claims
- 0587US7098147B2Semiconductor memory device and method for manufacturing semiconductor deviceFUJITSU AMD SEMICONDUCTOR LTD·Filed 2003·Granted Aug 29, 2006·39 cites·12 claims
- 0678US6447888B2Ceramic wiring boardKYOCERA CORP·Filed 2001·Granted Sep 10, 2002·26 cites·20 claims
- 0777US8993189B2Heat-resistant alloy, alloy member for fuel cell, fuel cell stack device, fuel cell module, and fuel cell deviceHIGASHI MASAHIKO·Filed 2010·Granted Mar 31, 2015·3 cites·4 claims
- 0877US6348427B1High-thermal-expansion glass ceramic sintered productKYOCERA CORP·Filed 2000·Granted Feb 19, 2002·26 cites·5 claims
- 0976US9325019B2Composite body, collector member, fuel battery cell device, and fuel battery deviceKYOCERA CORP·Filed 2012·Granted Apr 26, 2016·1 cites·6 claims
- 1076US6027791AStructure for mounting a wiring boardKYOCERA CORP·Filed 1997·Granted Feb 22, 2000·57 cites·15 claims
- 1176US5818295AOperational amplifier with stabilized DC operationsTEXAS INSTRUMENTS INC·Filed 1996·Granted Oct 6, 1998·46 cites·7 claims
- 1274US10157903B2Semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·7 claims
- 1374US9786927B2Conductive member, cell stack, electrochemical module, and electrochemical deviceKYOCERA CORP·Filed 2013·Granted Oct 10, 2017·1 cites·9 claims
- 1471US9935320B2Composite body, collector member, gas tank, and fuel cell deviceFUJIMOTO TETSUROU·Filed 2011·Granted Apr 3, 2018·1 cites·7 claims
- 1570US5763059ACircuit boardKYOCERA CORP·Filed 1996·Granted Jun 9, 1998·43 cites·13 claims
- 1670US2025309481A1Electrically conductive member, electrochemical cell device, module, and module housing deviceKYOCERA CORP·Filed 2023·Application pending·0 cites
- 1768US5650801ADrive circuit with rise and fall time equalizationTEXAS INSTRUMENTS JAPAN·Filed 1995·Granted Jul 22, 1997·34 cites·3 claims
- 1866US8749012B2Methods and structures for discharging plasma formed during the fabrication of semiconductor deviceHIGASHI MASAHIKO·Filed 2007·Granted Jun 10, 2014·3 cites·7 claims
- 1965US8669161B2Fabricating method of mirror bit memory device having split ONO film with top oxide film formed by oxidation processSPANSION LLC·Filed 2013·Granted Mar 11, 2014·1 cites·7 claims
- 2065US8404549B2Fabricating method of mirror bit memory device having split ONO film with top oxide film formed by oxidation processHIGASHI MASAHIKO·Filed 2008·Granted Mar 26, 2013·2 cites·13 claims
- 2163US8703350B2Heat-resistant alloy member, alloy member for fuel cell, collector member for fuel cell, cell stack, and fuel cell apparatusKYOCERA CORP·Filed 2013·Granted Apr 22, 2014·0 cites·6 claims
- 2262US10812064B2Source down power FET with integrated temperature sensorTEXAS INSTRUMENTS INC·Filed 2020·Granted Oct 20, 2020·0 cites·21 claims
- 2362US7820547B2Flash memory device with word lines of uniform width and method for manufacturing thereofSPANSION LLC·Filed 2008·Granted Oct 26, 2010·2 cites·7 claims
- 2461US7626227B2Semiconductor device with reduced transistor breakdown voltage for preventing substrate junction currentsSPANSION LLC·Filed 2006·Granted Dec 1, 2009·3 cites·5 claims
- 2560US2025220998A1Iii-n semiconductor device with substrate contactTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2660US2025311315A1Semiconductor devices with guard ring structuresTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2759US11888198B2Cell, cell stack device, module, and module housing deviceKYOCERA CORP·Filed 2019·Granted Jan 30, 2024·0 cites·10 claims
- 2859US2025142866A1Self-aligned gate structureTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2957US2023163338A1Cell, module and module housing deviceKYOCERA CORP·Filed 2021·Application pending·0 cites
- 3056US8952536B2Semiconductor device and method of fabricationHIGASHI MASAHIKO·Filed 2008·Granted Feb 10, 2015·0 cites·12 claims
- 3156US2009297917A1Heat-resistant alloy member, alloy member for fuel cell, collector member for fuel cell, cell stack, and fuel cell apparatusKYOCERA CORP·Filed 2006·Application pending·0 cites
- 3255US8610199B2Fabricating method of mirror bit memory device having split ONO film with top oxide film formed by oxidation processSPANSION LLC·Filed 2013·Granted Dec 17, 2013·0 cites·11 claims
- 3355US7977189B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2009·Granted Jul 12, 2011·0 cites·18 claims
- 3455US2008265309A1Semiconductor memory device and manufacturing method thereofSPANSION LLC·Filed 2008·Application pending·0 cites
- 3552US11177252B2Semiconductor device and method of fabricating the sameLAPIS SEMICONDUCTOR CO LTD·Filed 2020·Granted Nov 16, 2021·0 cites·7 claims
- 3652US7943982B2Semiconductor device having laminated electronic conductor on bit lineSPANSION LLC·Filed 2006·Granted May 17, 2011·0 cites·17 claims
- 3751US8278171B2Fabrication method for semiconductor device having laminated electronic conductor on bit lineFUJII KENICHI·Filed 2011·Granted Oct 2, 2012·0 cites·13 claims
- 3851US7910980B2Sonos device with insulating storage layer and P-N junction isolationSPANSION LLC·Filed 2008·Granted Mar 22, 2011·0 cites·15 claims
- 3951US7479427B2Semiconductor device and method of fabricationSPANSION LLC·Filed 2005·Granted Jan 20, 2009·0 cites·5 claims
- 4050US7573091B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2006·Granted Aug 11, 2009·0 cites·4 claims
- 4150US2017162677A1Sonos flash memory deviceMONTEREY RES LLC·Filed 2017·Application pending·0 cites
- 4248US2014002438A1Source driver and liquid crystal display deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2013·Application pending·0 cites
- 4348US2006228899A1Semiconductor memory device and method for manufacturing semiconductor deviceFUJITSU AMD SEMICONDUCTOR LTD·Filed 2006·Application pending·0 cites
- 4447US2010151348A1Fuel Cell and Method for Manufacturing the SameKYOCERA CORP·Filed 2006·Application pending·0 cites
- 4546US8076206B2Method for manufacturing SONOS flash memoryHIGASHI MASAHIKO·Filed 2008·Granted Dec 13, 2011·0 cites·10 claims
- 4646US2014021529A1Flash memory device with word lines of uniform width and method for manufacturing thereofSPANSION LLC·Filed 2012·Application pending·0 cites
- 4746US2022102338A1Electrostatic protection element and semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2021·Application pending·0 cites
- 4845US2013189835A1Method for cleaning a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 4945US2012181600A1Sonos flash memory deviceHIGASHI MASAHIKO·Filed 2011·Application pending·0 cites
- 5041US2010330794A1Method for cleaning a semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →