Inventor · disambiguated record
Masao Hirobe
Also filed as: HIROBE MASAO
2 granted patents·2 pending applications·4 citations·filing 2016–2024
52Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0183US12183651B2Semiconductor deviceAMKOR TECH JAPAN INC·Filed 2022·Granted Dec 31, 2024·1 cites·19 claims
- 0277US11488886B2Semiconductor deviceJ DEVICES CORP·Filed 2019·Granted Nov 1, 2022·3 cites·20 claims
- 0374US2025140636A1Semiconductor deviceAMKOR TECH JAPAN INC·Filed 2024·Application pending·0 cites
- 0443US2016233141A1Semiconductor deviceJ-DEVICES CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →