Inventor · disambiguated record
Masayuki Hiroi
Also filed as: HIROI MASAYUKI
26 granted patents·6 pending applications·219 citations·filing 1992–2023
95Inventor score
Files withNEC ELECTRONICS CORP6RENESAS ELECTRONICS CORP5SANDISK TECHNOLOGIES LLC4MITSUBISHI CHEM CORP3MITSUBISHI CHEM IND3
Top patents by PatentIndex Score
32 records- 0198US11081443B1Multi-tier three-dimensional memory device containing dielectric well structures for contact via structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Aug 3, 2021·29 cites·20 claims
- 0296US10734400B1Three-dimensional memory device including bit lines between memory elements and an underlying peripheral circuit and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Aug 4, 2020·28 cites·12 claims
- 0394US9613975B2Bridge line structure for bit line connection in a three-dimensional semiconductor deviceSANDISK TECHNOLOGIES INC·Filed 2015·Granted Apr 4, 2017·17 cites·23 claims
- 0489US7294932B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Nov 13, 2007·16 cites·14 claims
- 0586US10263066B2Memory and logic device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 16, 2019·9 cites·19 claims
- 0681US11508749B2Cutoff gate electrodes for switches for a three-dimensional memory device and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Nov 22, 2022·2 cites·6 claims
- 0781US7545040B2Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor deviceNEC CORP·Filed 2003·Granted Jun 9, 2009·25 cites·8 claims
- 0876US7479361B2Chemically amplified resist composition, process for manufacturing semiconductor device and patterning processNEC ELECTRONICS CORP·Filed 2004·Granted Jan 20, 2009·19 cites·7 claims
- 0976US5432037AImage-forming process, developer and image-forming systemMITSUBISHI CHEM IND·Filed 1992·Granted Jul 11, 1995·23 cites·16 claims
- 1074US7663240B2Semiconductor device with multiple interconnect layers and viasNEC ELECTRONICS CORP·Filed 2006·Granted Feb 16, 2010·6 cites·20 claims
- 1170US9111063B2Semiconductor device and layout design systemRENESAS ELECTRONICS CORP·Filed 2014·Granted Aug 18, 2015·2 cites·20 claims
- 1266US8273509B2Electrophotographic photoreceptor, and image forming device and electrophotographic photoreceptor cartridge using the same member cartridgeNAGAO YUKA·Filed 2007·Granted Sep 25, 2012·4 cites·33 claims
- 1366US5370957AElectrostatic developer and electrostatic developing methodMITSUBISHI CHEM IND·Filed 1993·Granted Dec 6, 1994·16 cites·15 claims
- 1464US9449929B2Semiconductor device and layout design systemRENESAS ELECTRONICS CORP·Filed 2015·Granted Sep 20, 2016·1 cites·10 claims
- 1561US7536667B2Method of semiconductor device and design supporting system of semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted May 19, 2009·2 cites·17 claims
- 1659US2025169070A1Three-dimensional memory device including crack-resistant backside passivation structure and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1757US11925027B2Three-dimensional memory device including sense amplifiers having a common width and separationSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 1853US7955980B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jun 7, 2011·0 cites·7 claims
- 1953US2009203208A1Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor deviceNEC CORP·Filed 2009·Application pending·0 cites
- 2051US2009075482A1Process for forming a pattern including on a semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 2150US8609309B2Electrophotographic photoreceptor and image-forming apparatusNAGAO YUKA·Filed 2010·Granted Dec 17, 2013·0 cites·6 claims
- 2250US7601640B2Method of manfacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Oct 13, 2009·0 cites·9 claims
- 2348US2012061844A1Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor deviceUEKI MAKOTO·Filed 2011·Application pending·0 cites
- 2447US5334856AImage readout element with oxytitanium phthalocyanineMITSUBISHI CHEM IND·Filed 1993·Granted Aug 2, 1994·12 cites·8 claims
- 2544US8288066B2Electrophotographic photoreceptor and image-forming apparatusNAGAO YUKA·Filed 2006·Granted Oct 16, 2012·0 cites·15 claims
- 2643US8329584B2Method of manufacturing semiconductor deviceTAKEWAKI TOSHIYUKI·Filed 2011·Granted Dec 11, 2012·0 cites·14 claims
- 2741US8598044B2Method of fabricating a semiconductor deviceUSAMI TATSUYA·Filed 2005·Granted Dec 3, 2013·0 cites·28 claims
- 2840US8663882B2Electrophotographic photosensitive body, image-forming device using same and cartridgeMITSUMORI TERUYUKI·Filed 2006·Granted Mar 4, 2014·0 cites·23 claims
- 2936US5614343AElectrophotographic copying process for reversal developmentMITSUBISHI CHEM CORP·Filed 1995·Granted Mar 25, 1997·4 cites·9 claims
- 3036US2011156219A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 3135US2006134541A1Electrophotographic photoreceptorMITSUBISHI CHEM CORP·Filed 2005·Application pending·0 cites
- 3227US5858594AElectrophotographic photoreceptorMITSUBISHI CHEM CORP·Filed 1997·Granted Jan 12, 1999·4 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →