Inventor · disambiguated record
Masahiro Horibe
Also filed as: HORIBE MASAHIRO
14 granted patents·4 pending applications·94 citations·filing 2003–2021
90Inventor score
Top patents by PatentIndex Score
18 records- 0188US7094692B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2004·Granted Aug 22, 2006·38 cites·17 claims
- 0283US7417320B2Substrate structure and manufacturing method of the sameFUJITSU LTD·Filed 2005·Granted Aug 26, 2008·9 cites·13 claims
- 0383US7368823B1Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2006·Granted May 6, 2008·8 cites·4 claims
- 0480US7095227B2Superconducting driver circuitINT SUPERCONDUCTIVITY TECH·Filed 2003·Granted Aug 22, 2006·23 cites·10 claims
- 0567US10944146B2Dielectric waveguide having a dielectric waveguide body and a dielectric waveguide end with specified densities and method of producingDAIKIN IND LTD·Filed 2017·Granted Mar 9, 2021·1 cites·11 claims
- 0658US7091515B2High-temperature superconducting device and manufacturing method thereofINT SUPERCONDUCTIVITY TECH·Filed 2004·Granted Aug 15, 2006·4 cites·6 claims
- 0756US7300909B2Superconducting circuitFUJITSU LTD·Filed 2004·Granted Nov 27, 2007·5 cites·10 claims
- 0856US6790675B2Josephson device and fabrication process thereofINT SUPERCONDUCTIVITY TECH·Filed 2003·Granted Sep 14, 2004·6 cites·9 claims
- 0954US11796439B2Uniformity output device, uniformity output method, and non-transitory computer-readable recording medium for determining whether a particle diameter of particles in a mixture is uniform or non-uniformHIOKI ELECTRIC WORKS·Filed 2021·Granted Oct 24, 2023·0 cites·9 claims
- 1052US11152678B2Connector-attached dielectric waveguide including a connecting portion and a fixing portion that are slidably axially movable with respect to each otherDAIKIN IND LTD·Filed 2018·Granted Oct 19, 2021·0 cites·4 claims
- 1148US2005212014A1Semiconductor device and semiconductor sensorHORIBE MASAHIRO·Filed 2004·Application pending·0 cites
- 1248US2006247131A1High-temperature superconducting device and manufacturing method thereofINT SUPERCONDUCTIVITY TECH·Filed 2006·Application pending·0 cites
- 1346US7323711B2High-temperature superconductive deviceFUJITSU LTD·Filed 2004·Granted Jan 29, 2008·0 cites·6 claims
- 1444US2024012026A1Method for determining contact or connection state, and information processing deviceAIST·Filed 2021·Application pending·0 cites
- 1542US7948081B2Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor deviceFUJITSU LTD·Filed 2005·Granted May 24, 2011·0 cites·18 claims
- 1640US11131699B2Method for determining probe angle, high-frequency test system, program and storage mediumAIST·Filed 2018·Granted Sep 28, 2021·0 cites·10 claims
- 1738US7786487B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2004·Granted Aug 31, 2010·0 cites·8 claims
- 1836US2004053079A1High-temperature superconducting deviceFUJITSU LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →