Inventor · disambiguated record
Masaaki Hoshiyama
Also filed as: HOSHIYAMA MASAAKI
6 granted patents·2 pending applications·4 citations·filing 2010–2020
69Inventor score
Files withNAMICS CORP8
Top patents by PatentIndex Score
8 records- 0171US11623813B2Resin composition-filled syringe, and production method and preservation method for sameNAMICS CORP·Filed 2020·Granted Apr 11, 2023·1 cites·12 claims
- 0261US11315846B2Semiconductor deviceNAMICS CORP·Filed 2018·Granted Apr 26, 2022·1 cites·7 claims
- 0360US11850625B2Syringe filled with resin composition and storage method thereforNAMICS CORP·Filed 2020·Granted Dec 26, 2023·0 cites·8 claims
- 0460US9417228B2Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production methodNAMICS CORP·Filed 2014·Granted Aug 16, 2016·2 cites·8 claims
- 0539US2020001011A1Prefilled syringe and preservation method for resin compositeNAMICS CORP·Filed 2018·Application pending·0 cites
- 0634US11485848B2NCF for pressure mounting, cured product thereof, and semiconductor device including sameNAMICS CORP·Filed 2018·Granted Nov 1, 2022·0 cites·6 claims
- 0734US2010244279A1Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the sameNAMICS CORP·Filed 2010·Application pending·0 cites
- 0828US10388583B2Thermosetting resin composition and method of producing sameNAMICS CORP·Filed 2015·Granted Aug 20, 2019·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →