Inventor · disambiguated record
Matthew Martin Huie
Also filed as: HUIE MATTHEW MARTIN
0 granted patents·4 pending applications·0 citations·filing 2021–2023
Technology areasH10W
Files withLAM RES CORP4
Top patents by PatentIndex Score
4 records- 0153US2025333845A1Conformal copper deposition on thin liner layerLAM RES CORP·Filed 2023·Application pending·0 cites
- 0247US2023197509A1Wet functionalization of dielectric surfacesLAM RES CORP·Filed 2021·Application pending·0 cites
- 0346US2023227992A1Electrofill from alkaline electroplating solutionsLAM RES CORP·Filed 2021·Application pending·0 cites
- 0446US2023260834A1Metal oxide diffusion barriersLAM RES CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →