Inventor · disambiguated record
Masashi Ichikawa
Also filed as: ICHIKAWA MASASHI
10 granted patents·4 pending applications·202 citations·filing 1984–2018
90Inventor score
Top patents by PatentIndex Score
14 records- 0196US7230680B2Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation methodNIKON CORP·Filed 2003·Granted Jun 12, 2007·109 cites·20 claims
- 0291US7474386B2Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation methodTOSHIBA KK·Filed 2007·Granted Jan 6, 2009·14 cites·12 claims
- 0378US7365830B2Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation methodTOSHIBA KK·Filed 2007·Granted Apr 29, 2008·4 cites·6 claims
- 0464US5047608AMethod and apparatus for resistance welding wherein the electrode axis is included with respect to the electrode forcing axisNIPPON STEEL CORP·Filed 1990·Granted Sep 10, 1991·24 cites·16 claims
- 0558US6048792AMethod for manufacturing an interconnection structure in a semiconductor deviceNEC CORP·Filed 1997·Granted Apr 11, 2000·24 cites·8 claims
- 0656US7276427B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2003·Granted Oct 2, 2007·6 cites·4 claims
- 0752US7203559B2Method for manufacturing semiconductor wafer, method for receiving order for manufacture of semiconductor wafer, and system for receiving order for manufacture of semiconductor waferSHINETSU HANDOTAI KK·Filed 2003·Granted Apr 10, 2007·4 cites·35 claims
- 0848US10812665B2Information transmitting apparatus, multifunctional peripheral, information transmitting method, and non-transitory recording mediumSHARP KK·Filed 2018·Granted Oct 20, 2020·0 cites·18 claims
- 0942US4561561AContainer having an easy opening end with a tab affixed by ultrasonic weldingNIPPON STEEL CORP·Filed 1984·Granted Dec 31, 1985·11 cites·5 claims
- 1042US2019068834A1Information transmitting apparatus, information transmitting system, multifunctional peripheral, information transmitting method, and non-transitory recording mediumSHARP KK·Filed 2018·Application pending·0 cites
- 1142US2019068804A1Information transmission apparatus, information transmission system, multifunction peripheral, information transmission method, and information transmission programSHARP KK·Filed 2018·Application pending·0 cites
- 1242US2019068835A1Information transmission apparatus, information transmission system, multifunction peripheral, information transmission method, and information transmission programSHARP KK·Filed 2018·Application pending·0 cites
- 1340US2009203212A1Surface Grinding Method and Manufacturing Method for Semiconductor WaferSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
- 1436US6294228B1Method for forming thin filmsNEC CORP·Filed 1999·Granted Sep 25, 2001·6 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →