Inventor · disambiguated record
Masashi Iio
Also filed as: IIO MASASHI
29 granted patents·12 pending applications·38 citations·filing 2009–2025
93Inventor score
Top patents by PatentIndex Score
41 records- 0191US10457779B2Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2017·Granted Oct 29, 2019·4 cites·18 claims
- 0289US10816900B2Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 27, 2020·3 cites·8 claims
- 0389US8329384B2Resist-modifying composition and pattern forming processWATANABE TAKERU·Filed 2010·Granted Dec 11, 2012·10 cites·10 claims
- 0487US9377689B2Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting filmSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 28, 2016·5 cites·15 claims
- 0586US8658346B2Pattern forming process, chemically amplified positive resist composition, and resist-modifying compositionWATANABE TAKERU·Filed 2010·Granted Feb 25, 2014·6 cites·15 claims
- 0681US10216085B2Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 26, 2019·2 cites·8 claims
- 0776US8703404B2Patterning processHATAKEYAMA JUN·Filed 2012·Granted Apr 22, 2014·2 cites·21 claims
- 0874US7985528B2Positive resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2009·Granted Jul 26, 2011·3 cites·6 claims
- 0973US8426105B2Resist-modifying composition and pattern forming processWATANABE TAKERU·Filed 2010·Granted Apr 23, 2013·2 cites·11 claims
- 1072US9400428B2Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrateSHINETSU CHEMICAL CO·Filed 2014·Granted Jul 26, 2016·1 cites·21 claims
- 1168US12197127B2Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2022·Granted Jan 14, 2025·0 cites·13 claims
- 1265US11333975B2Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic componentIBM·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 1365US10919918B2Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic partsSHINETSU CHEMICAL CO·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
- 1463US2025147420A1Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic ComponentSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1562US2025068070A1Negative-type photosensitive resin composition, patterning method, method for forming cured film, interlayer insulative film, surface-protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1660US11572442B2Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic componentIBM·Filed 2020·Granted Feb 7, 2023·0 cites·19 claims
- 1759US12195568B2Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2022·Granted Jan 14, 2025·0 cites·18 claims
- 1859US10203601B2Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 12, 2019·0 cites·2 claims
- 1959US2025355350A1Negative-type photosensitive resin composition, patterning process, method for forming cured coating, interlayer insulating film, surface protecting film, and electronic componentSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 2057US12085856B2Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2021·Granted Sep 10, 2024·0 cites·16 claims
- 2157US2020326624A1Positive photosensitive resin composition, patterning process, method of forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2257US2023350294A1Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic ComponentSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 2356US2022043348A1Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 2452US11892773B2Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2021·Granted Feb 6, 2024·0 cites·16 claims
- 2550US2010086878A1Patterning processSHINETSU CHEMICAL CO·Filed 2009·Application pending·0 cites
- 2649US2010062374A1Positive resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2009·Application pending·0 cites
- 2749US2010062372A1Positive resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2009·Application pending·0 cites
- 2849US2010062373A1Positive resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2009·Application pending·0 cites
- 2949US2010159392A1Patterning process and resist compositionSHINETSU CHEMICAL CO·Filed 2009·Application pending·0 cites
- 3047US9017928B2Methods for manufacturing resin structure and micro-structureSHINETSU CHEMICAL CO·Filed 2014·Granted Apr 28, 2015·0 cites·13 claims
- 3146US11768434B2Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic partsSHINETSU CHEMICAL CO·Filed 2019·Granted Sep 26, 2023·0 cites·19 claims
- 3246US9310681B2Negative resist composition and patterning process using sameSHINETSU CHEMICAL CO·Filed 2014·Granted Apr 12, 2016·0 cites·12 claims
- 3346US9017905B2Chemically amplified positive resist composition and pattern forming processSHINETSU CHEMICAL CO·Filed 2013·Granted Apr 28, 2015·0 cites·8 claims
- 3444US11150556B2Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic partsSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 19, 2021·0 cites·16 claims
- 3544US8951717B2Methods for manufacturing resin structure and micro-structureSHINETSU CHEMICAL CO·Filed 2013·Granted Feb 10, 2015·0 cites·7 claims
- 3640US10087288B2Silicone skeleton-containing polymer compound, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, substrate, and semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2015·Granted Oct 2, 2018·0 cites·25 claims
- 3740US2013065183A1Patterning process and resist compositionKOBAYASHI TOMOHIRO·Filed 2012·Application pending·0 cites
- 3838US8367310B2Pattern forming process and resist-modifying compositionSHINETSU CHEMICAL CO·Filed 2010·Granted Feb 5, 2013·0 cites·6 claims
- 3937US10197914B2Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminateSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 5, 2019·0 cites·20 claims
- 4036US10114287B2Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrateSHINETSU CHEMICAL CO·Filed 2015·Granted Oct 30, 2018·0 cites·32 claims
- 4135US9557645B2Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrateSHINETSU CHEMICAL CO·Filed 2015·Granted Jan 31, 2017·0 cites·21 claims
Join the waitlist — get patent alerts
Get an alert when Masashi Iio files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →