Inventor · disambiguated record
Marc C. Jin
Also filed as: JIN MARC C
11 granted patents·40 citations·filing 2007–2014
87Inventor score
Top patents by PatentIndex Score
11 records- 0193US9375822B2Polishing pad having micro-grooves on the pad surfaceFNS TECH CO LTD·Filed 2014·Granted Jun 28, 2016·12 cites·4 claims
- 0286US8172648B2Chemical-mechanical planarization padLEFEVRE PAUL·Filed 2008·Granted May 8, 2012·13 cites·16 claims
- 0374US8900036B2Polishing pad having micro-grooves on the pad surfaceHSU OSCAR K·Filed 2012·Granted Dec 2, 2014·2 cites·15 claims
- 0470US8137166B2Polishing pad having micro-grooves on the pad surfaceHSU OSCAR K·Filed 2007·Granted Mar 20, 2012·3 cites·18 claims
- 0567US8758659B2Method of grooving a chemical-mechanical planarization padLEFEVRE PAUL·Filed 2010·Granted Jun 24, 2014·2 cites·19 claims
- 0667US8430721B2Chemical-mechanical planarization padHSU OSCAR K·Filed 2008·Granted Apr 30, 2013·3 cites·16 claims
- 0761US8491360B2Three-dimensional network in CMP padLEFEVRE PAUL·Filed 2008·Granted Jul 23, 2013·2 cites·28 claims
- 0861US7985121B2Chemical-mechanical planarization pad having end point detection windowINNOPAD INC·Filed 2008·Granted Jul 26, 2011·2 cites·17 claims
- 0960US9796063B2Multi-layered chemical-mechanical planarization padFNS TECH CO LTD·Filed 2014·Granted Oct 24, 2017·0 cites·13 claims
- 1056US8377351B2Polishing pad with controlled void formationINNOPAD INC·Filed 2008·Granted Feb 19, 2013·1 cites·16 claims
- 1151US8790165B2Multi-layered chemical-mechanical planarization padLEFEVRE PAUL·Filed 2010·Granted Jul 29, 2014·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →