Inventor · disambiguated record
Mark S. Johnson
Also filed as: JOHNSON MARK · JOHNSON MARK S · JOHNSON MARK T · JOHNSON MARK THOMAS
54 granted patents·12 pending applications·1,763 citations·filing 1981–2024
99Inventor score
Files withMICRON TECHNOLOGY INC36APPLIED MATERIALS INC5JOHNSON MARK S4DOW CHEMICAL CO2HOUSTON IND INC2
Top patents by PatentIndex Score
66 records- 0198US6549821B1Stereolithographic method and apparatus for packaging electronic components and resulting structuresMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 15, 2003·145 cites·60 claims
- 0298US6106625AReactor useful for chemical vapor deposition of titanium nitrideAPPLIED MATERIALS INC·Filed 1998·Granted Aug 22, 2000·627 cites·28 claims
- 0396US6208519B1Thermally enhanced semiconductor packageMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·176 cites·36 claims
- 0490US5968276AHeat exchange passage connectionAPPLIED MATERIALS INC·Filed 1997·Granted Oct 19, 1999·85 cites·13 claims
- 0589US7071421B2Stacked microfeature devices and associated methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 4, 2006·39 cites·40 claims
- 0685US6176930B1Apparatus and method for controlling a flow of process material to a deposition chamberAPPLIED MATERIALS INC·Filed 1999·Granted Jan 23, 2001·62 cites·18 claims
- 0784US7742313B2Stacked microfeature devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 22, 2010·8 cites·21 claims
- 0884US6050446APivoting lid assembly for a chamberAPPLIED MATERIALS INC·Filed 1997·Granted Apr 18, 2000·69 cites·16 claims
- 0984US6033614AManual pellet loader for Boschman automoldsMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 7, 2000·41 cites·7 claims
- 1084US2024153917A1Stacked microfeature devices and associated methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1183US8491967B2In-situ chamber treatment and deposition processMA PAUL F·Filed 2008·Granted Jul 23, 2013·12 cites·2 claims
- 1283US6294825B1Asymmetrical mold of multiple-part matrixesMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·56 cites·22 claims
- 1382US7608788B2Plating buss and a method of use thereofMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 27, 2009·6 cites·17 claims
- 1481US6143581AAsymmetric transfer molding method and an asymmetric encapsulation made therefromMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 7, 2000·41 cites·23 claims
- 1580US7148974B1Method for tracking the location of mobile agents using stand-off detection techniqueSANDIA CORP·Filed 2004·Granted Dec 12, 2006·54 cites·20 claims
- 1679US7132734B2Microelectronic component assemblies and microelectronic component lead frame structuresMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 7, 2006·17 cites·42 claims
- 1778US11887970B2Stacked microfeature devices and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 1878US7298025B2Microelectronic component assemblies and microelectronic component lead frame structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 20, 2007·5 cites·6 claims
- 1977US4892700AProcess for making multilayered, formable laminatesPOLYCAST TECHNOLOGY CORP·Filed 1987·Granted Jan 9, 1990·34 cites·31 claims
- 2076US6063441AProcessing chamber and method for confining plasmaAPPLIED MATERIALS INC·Filed 1997·Granted May 16, 2000·42 cites·7 claims
- 2175US9515046B2Stacked microfeature devices and associated methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 6, 2016·2 cites·20 claims
- 2273US10062667B2Stacked microfeature devices and associated methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 28, 2018·1 cites·20 claims
- 2372US9447497B2Processing chamber gas delivery system with hot-swappable ampouleWU DIEN-YEH·Filed 2014·Granted Sep 20, 2016·5 cites·11 claims
- 2472US7247520B2Microelectronic component assemblies and microelectronic component lead frame structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 24, 2007·3 cites·11 claims
- 2571US7655508B2Overmolding encapsulation process and encapsulated article made therefromMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 2, 2010·11 cites·18 claims
- 2669US8400780B2Stacked microfeature devicesHENG MUNG SUAN·Filed 2010·Granted Mar 19, 2013·2 cites·6 claims
- 2769US4976977APelleting agent having energy valueOIL DRI CORP OF AMERICA·Filed 1989·Granted Dec 11, 1990·42 cites·13 claims
- 2867US6417018B1Asymmetrical molding method for multiple part matrixesMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 9, 2002·12 cites·23 claims
- 2965US9490220B2Redistribution structures for microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2015·Granted Nov 8, 2016·1 cites·15 claims
- 3065US7151013B2Semiconductor package having exposed heat dissipating surface and method of fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 19, 2006·10 cites·6 claims
- 3164US4775473APackaged absorbentOIL DRI CORP OF AMERICA·Filed 1987·Granted Oct 4, 1988·19 cites·7 claims
- 3263US11373979B2Stacked microfeature devices and associated methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 28, 2022·0 cites·30 claims
- 3362US6632575B1Precision fiducialMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 14, 2003·8 cites·9 claims
- 3462US4359891ARepetitive chromatographic apparatusDOW CHEMICAL CO·Filed 1981·Granted Nov 23, 1982·25 cites·4 claims
- 3561US6541856B2Thermally enhanced high density semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 1, 2003·8 cites·28 claims
- 3661US5050356AImmured foundationHOUSTON IND INC·Filed 1990·Granted Sep 24, 1991·29 cites·9 claims
- 3759US7632747B2Conductive structures for microfeature devices and methods for fabricating microfeature devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 15, 2009·5 cites·43 claims
- 3859US6909929B2Stereolithographic method and apparatus for packaging electronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 21, 2005·19 cites·18 claims
- 3958US8946873B2Redistribution structures for microfeature workpiecesJOHNSON MARK S·Filed 2007·Granted Feb 3, 2015·1 cites·22 claims
- 4058US8222727B2Conductive structures for microfeature devices and methods for fabricating microfeature devicesJOHNSON MARK S·Filed 2009·Granted Jul 17, 2012·0 cites·18 claims
- 4158US7181837B2Plating buss and a method of use thereofMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 27, 2007·4 cites·15 claims
- 4258US6820525B2Precision FiducialMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 23, 2004·6 cites·12 claims
- 4357US9313902B2Conductive structures for microfeature devices and methods for fabricating microfeature devicesJOHNSON MARK S·Filed 2012·Granted Apr 12, 2016·0 cites·20 claims
- 4455US6601294B1Method for making a packaged semiconductor deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 5, 2003·5 cites·12 claims
- 4554US7923824B2Microelectronic component assemblies and microelectronic component lead frame structuresMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 12, 2011·0 cites·19 claims
- 4654US7652365B2Microelectronic component assemblies and microelectronic component lead frame structuresMICRON TECHNOLOGY INC·Filed 2007·Granted Jan 26, 2010·0 cites·6 claims
- 4754US7296346B2Plating buss and a method of use thereofMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 20, 2007·0 cites·12 claims
- 4853US7439450B2Plating buss and a method of use thereofMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 21, 2008·0 cites·8 claims
- 4952US4999966AMethod of forming an-before "immured"HOUSTON IND INC·Filed 1989·Granted Mar 19, 1991·17 cites·7 claims
- 5048US2011147910A1Method for stacking die in thin, small-outline packageMICRON TECHNOLOGY INC·Filed 2009·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →