Inventor · disambiguated record
Mathias Kaempf
Also filed as: KAEMPF MATHIAS
8 granted patents·1 pending application·8 citations·filing 2004–2017
78Inventor score
Top patents by PatentIndex Score
9 records- 0169US9728459B2Method for singulating an assemblage into semiconductor chips, and semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2013·Granted Aug 8, 2017·2 cites·13 claims
- 0264US10115869B2Optoelectronic semiconductor chip, optoelectronic component and method for singulating semiconductor chipsOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Oct 30, 2018·2 cites·9 claims
- 0361US10276748B2Radiation-emitting semiconductor chip, method for producing a plurality of radiation-emitting semiconductor chips and optoelectronic component having a radiation-emitting semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2015·Granted Apr 30, 2019·1 cites·10 claims
- 0456US9165816B2Method for singulating a component composite assemblyZULL HERIBERT·Filed 2012·Granted Oct 20, 2015·1 cites·19 claims
- 0554US9873166B2Method for dividing a composite into semiconductor chips, and semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Jan 23, 2018·0 cites·16 claims
- 0651US10232471B2Method for dividing a composite into semiconductor chips, and semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Granted Mar 19, 2019·0 cites·12 claims
- 0747US10090198B2Method for separating substrates and semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Oct 2, 2018·0 cites·12 claims
- 0847US2018047628A1Method for singulating an assemblage into semiconductor chips, and semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Application pending·0 cites
- 0943US7445119B2Chip receptacle, method for fabricating a chip receptacle and chip transport containerOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2004·Granted Nov 4, 2008·2 cites·49 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →