Inventor · disambiguated record
Masahito Kanamura
Also filed as: KANAMURA MASAHITO
22 granted patents·11 pending applications·89 citations·filing 2005–2016
94Inventor score
Top patents by PatentIndex Score
33 records- 0189US9536967B2Recessed ohmic contacts in a III-N deviceTRANSPHORM INC·Filed 2014·Granted Jan 3, 2017·15 cites·24 claims
- 0288US8912571B2Compound semiconductor device including first film on compound semiconductor layer and second film on first film and method of manufacturing the sameKANAMURA MASAHITO·Filed 2011·Granted Dec 16, 2014·10 cites·13 claims
- 0388US8866157B2Semiconductor device and method of fabricating the semiconductor deviceFUJITSU LTD·Filed 2013·Granted Oct 21, 2014·9 cites·20 claims
- 0484US8581261B2Compound semiconductor device and method of manufacturing the sameKANAMURA MASAHITO·Filed 2011·Granted Nov 12, 2013·5 cites·10 claims
- 0583US8357602B2Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2010·Granted Jan 22, 2013·6 cites·8 claims
- 0682US8222672B2Semiconductor device and manufacturing method thereofKANAMURA MASAHITO·Filed 2006·Granted Jul 17, 2012·10 cites·10 claims
- 0780US7948062B2Semiconductor device and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2008·Granted May 24, 2011·6 cites·18 claims
- 0878US9608083B2Semiconductor deviceFUJITSU LTD·Filed 2015·Granted Mar 28, 2017·2 cites·10 claims
- 0977US8941146B2Compound semiconductor device and manufacturing methodKANAMURA MASAHITO·Filed 2010·Granted Jan 27, 2015·5 cites·6 claims
- 1076US8846479B2Semiconductor device and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2013·Granted Sep 30, 2014·3 cites·20 claims
- 1176US8426260B2Compound semiconductor device and method of manufacturing the sameMIYAJIMA TOYOO·Filed 2011·Granted Apr 23, 2013·5 cites·16 claims
- 1275US9461135B2Nitride semiconductor device with multi-layer structure electrode having different work functionsFUJITSU LTD·Filed 2014·Granted Oct 4, 2016·3 cites·20 claims
- 1370US9331190B2Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2012·Granted May 3, 2016·2 cites·4 claims
- 1470US7800133B2Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2008·Granted Sep 21, 2010·3 cites·8 claims
- 1567US8389351B2Method for fabricating semiconductor deviceOHKI TOSHIHIRO·Filed 2011·Granted Mar 5, 2013·2 cites·20 claims
- 1666US9269782B2Semiconductor deviceKANAMURA MASAHITO·Filed 2012·Granted Feb 23, 2016·2 cites·18 claims
- 1761US9349828B2Semiconductor device and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2014·Granted May 24, 2016·1 cites·20 claims
- 1860US8999772B2Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2014·Granted Apr 7, 2015·0 cites·3 claims
- 1957US8895378B2Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2013·Granted Nov 25, 2014·0 cites·6 claims
- 2052US9966445B2Semiconductor device and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2016·Granted May 8, 2018·0 cites·6 claims
- 2152US8603903B2Semiconductor device manufacturing methodKANAMURA MASAHITO·Filed 2012·Granted Dec 10, 2013·0 cites·6 claims
- 2250US2009194791A1Compound semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2009·Application pending·0 cites
- 2349US8173529B2Semiconductor device manufacturing methodKANAMURA MASAHITO·Filed 2010·Granted May 8, 2012·0 cites·5 claims
- 2448US2012139630A1Compound semiconductor device and method of manufacturing the sameOZAKI SHIROU·Filed 2011·Application pending·0 cites
- 2548US2014080277A1Compound semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2013·Application pending·0 cites
- 2648US2012091522A1Semiconductor device and manufacturing method thereofOZAKI SHIROU·Filed 2011·Application pending·0 cites
- 2746US2015194514A1Compound semiconductor device having a gate electrode and method of manufacturing the sameFUJITSU LTD·Filed 2015·Application pending·0 cites
- 2845US2006157735A1Compound semiconductor deviceEUDYNA DEVICES INC·Filed 2005·Application pending·0 cites
- 2944US2011133206A1Compound semiconductor deviceFUJITSU LTD·Filed 2011·Application pending·0 cites
- 3041US2014264364A1Semiconductor deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3141US2014092636A1Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3238US2006197107A1Semiconductor device and production method thereofFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3336US2012205662A1Semiconductor device, power supply device, amplifier, and method of manufacturing semiconductor deviceNAKAMURA NORIKAZU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →