Inventor · disambiguated record
Marcos Karnezos
Also filed as: KARNEZOS MARCOS
68 granted patents·8 pending applications·5,160 citations·filing 1984–2010
99Inventor score
Top patents by PatentIndex Score
76 records- 0199US7429786B2Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted Sep 30, 2008·177 cites·15 claims
- 0299US7101731B2Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) packageCHIPPAC INC·Filed 2005·Granted Sep 5, 2006·86 cites·20 claims
- 0399US6933598B2Semiconductor stacked multi-package module having inverted second package and electrically shielded first packageCHIPPAC INC·Filed 2003·Granted Aug 23, 2005·190 cites·30 claims
- 0499US6906416B2Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) packageCHIPPAC INC·Filed 2003·Granted Jun 14, 2005·183 cites·22 claims
- 0598US7429787B2Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted Sep 30, 2008·88 cites·17 claims
- 0698US7394148B2Module having stacked chip scale semiconductor packagesSTATS CHIPPAC LTD·Filed 2006·Granted Jul 1, 2008·74 cites·13 claims
- 0798US7372141B2Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted May 13, 2008·109 cites·24 claims
- 0898US7247519B2Method for making a semiconductor multi-package module having inverted bump chip carrier second packageCHIPPAC INC·Filed 2006·Granted Jul 24, 2007·42 cites·6 claims
- 0998US7169642B2Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) packageCHIPPAC INC·Filed 2006·Granted Jan 30, 2007·47 cites·19 claims
- 1098US7166494B2Method of fabricating a semiconductor stacked multi-package module having inverted second packageCHIPPAC INC·Filed 2006·Granted Jan 23, 2007·37 cites·8 claims
- 1198US7061088B2Semiconductor stacked multi-package module having inverted second packageCHIPPAC INC·Filed 2003·Granted Jun 13, 2006·125 cites·11 claims
- 1298US7057269B2Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) packageCHIPPAC INC·Filed 2003·Granted Jun 6, 2006·103 cites·12 claims
- 1398US7053477B2Semiconductor multi-package module having inverted bump chip carrier second packageCHIPPAC INC·Filed 2003·Granted May 30, 2006·125 cites·14 claims
- 1498US7049691B2Semiconductor multi-package module having inverted second package and including additional die or stacked package on second packageCHIPPAC INC·Filed 2003·Granted May 23, 2006·100 cites·13 claims
- 1598US7045887B2Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) packageCHIPPAC INC·Filed 2003·Granted May 16, 2006·120 cites·22 claims
- 1698US7034387B2Semiconductor multipackage module including processor and memory package assembliesCHIPPAC INC·Filed 2003·Granted Apr 25, 2006·118 cites·38 claims
- 1798US6838761B2Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shieldCHIPPAC INC·Filed 2003·Granted Jan 4, 2005·222 cites·30 claims
- 1898US5397921ATab grid arrayADVANCED SEMICONDUCTOR ASSEMBL·Filed 1993·Granted Mar 14, 1995·513 cites·15 claims
- 1997US7288434B2Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second packageCHIPPAC INC·Filed 2006·Granted Oct 30, 2007·28 cites·31 claims
- 2097US7064426B2Semiconductor multi-package module having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2003·Granted Jun 20, 2006·129 cites·10 claims
- 2197US5409865AProcess for assembling a TAB grid array package for an integrated circuitADVANCED SEMICONDUCTOR ASSEMBL·Filed 1994·Granted Apr 25, 1995·377 cites·7 claims
- 2296US7306973B2Method for making a semiconductor multipackage module including a processor and memory package assembliesCHIPPAC INC·Filed 2006·Granted Dec 11, 2007·31 cites·13 claims
- 2396US7163842B2Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)CHIP PAC INC·Filed 2006·Granted Jan 16, 2007·54 cites·16 claims
- 2496US7053476B2Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2003·Granted May 30, 2006·103 cites·20 claims
- 2596US6972481B2Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2003·Granted Dec 6, 2005·118 cites·17 claims
- 2696US5843808AStructure and method for automated assembly of a tab grid array packageASAT LTD·Filed 1996·Granted Dec 1, 1998·218 cites·9 claims
- 2796US4813129AInterconnect structure for PC boards and integrated circuitsHEWLETT PACKARD CO·Filed 1987·Granted Mar 21, 1989·159 cites·3 claims
- 2895US7494847B2Method for making a semiconductor multi-package module having inverted wire bond carrier second packageCHIPPAC INC·Filed 2007·Granted Feb 24, 2009·18 cites·6 claims
- 2995US7364946B2Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) packageCHIPPAC INC·Filed 2007·Granted Apr 29, 2008·20 cites·18 claims
- 3095US6020637ABall grid array semiconductor packageSIGNETICS KP CO LTD·Filed 1997·Granted Feb 1, 2000·242 cites·44 claims
- 3194US7749807B2Method of fabricating a semiconductor multipackage module including a processor and memory package assembliesCHIPPAC INC·Filed 2007·Granted Jul 6, 2010·24 cites·26 claims
- 3294US6967126B2Method for manufacturing plastic ball grid array with integral heatsinkCHIPPAC INC·Filed 2003·Granted Nov 22, 2005·80 cites·17 claims
- 3394US6326678B1Molded plastic package with heat sink and enhanced electrical performanceASAT LTD·Filed 1993·Granted Dec 4, 2001·305 cites·19 claims
- 3493US7687313B2Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) packageSTATS CHIPPAC LTD·Filed 2008·Granted Mar 30, 2010·12 cites·17 claims
- 3593US7358115B2Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sidesCHIPPAC INC·Filed 2007·Granted Apr 15, 2008·13 cites·8 claims
- 3693US7279361B2Method for making a semiconductor multi-package module having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2006·Granted Oct 9, 2007·22 cites·7 claims
- 3793US7253511B2Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2004·Granted Aug 7, 2007·67 cites·44 claims
- 3891US7692279B2Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2007·Granted Apr 6, 2010·18 cites·8 claims
- 3990US7205647B2Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2003·Granted Apr 17, 2007·50 cites·13 claims
- 4089US7645634B2Method of fabricating module having stacked chip scale semiconductor packagesSTATS CHIPPAC LTD·Filed 2008·Granted Jan 12, 2010·15 cites·8 claims
- 4189US6549413B2Tape ball grid array semiconductor package structure and assembly processCHIPPAC INC·Filed 2002·Granted Apr 15, 2003·60 cites·20 claims
- 4288US7582960B2Multiple chip package module including die stacked over encapsulated packageSTATS CHIPPAC LTD·Filed 2006·Granted Sep 1, 2009·16 cites·14 claims
- 4388US7351610B2Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrateCHIPPAC INC·Filed 2007·Granted Apr 1, 2008·7 cites·16 claims
- 4488US4862490AVacuum windows for soft x-ray machinesHEWLETT PACKARD CO·Filed 1988·Granted Aug 29, 1989·54 cites·15 claims
- 4587US6323065B1Methods for manufacturing ball grid array assembly semiconductor packagesSIGNETICS·Filed 2000·Granted Nov 27, 2001·48 cites·19 claims
- 4686US8970049B2Multiple chip package module having inverted package stacked over dieKARNEZOS MARCOS·Filed 2004·Granted Mar 3, 2015·42 cites·49 claims
- 4786US8143100B2Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packagesKARNEZOS MARCOS·Filed 2007·Granted Mar 27, 2012·11 cites·6 claims
- 4886US7935572B2Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packagesCHIPPAC INC·Filed 2010·Granted May 3, 2011·6 cites·35 claims
- 4985US8030134B2Stacked semiconductor package having adhesive/spacer structure and insulationCHIPPAC INC·Filed 2006·Granted Oct 4, 2011·10 cites·32 claims
- 5085US7736950B2Flip chip interconnectionSTATS CHIPPAC LTD·Filed 2006·Granted Jun 15, 2010·15 cites·33 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →