Inventor · disambiguated record
Masaki Kasai
Also filed as: KASAI MASAKI
15 granted patents·3 pending applications·49 citations·filing 2005–2024
92Inventor score
Top patents by PatentIndex Score
18 records- 0193US7714448B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2005·Granted May 11, 2010·13 cites·9 claims
- 0291US9601441B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2016·Granted Mar 21, 2017·4 cites·15 claims
- 0391US9312228B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2015·Granted Apr 12, 2016·4 cites·15 claims
- 0489US11069591B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·19 claims
- 0589US9111819B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2014·Granted Aug 18, 2015·4 cites·22 claims
- 0688US8928156B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2014·Granted Jan 6, 2015·4 cites·22 claims
- 0788US8786106B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2013·Granted Jul 22, 2014·4 cites·11 claims
- 0886US10431516B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2017·Granted Oct 1, 2019·2 cites·11 claims
- 0985US8575764B2Semiconductor device and method for manufacturing semiconductor deviceMIYATA OSAMU·Filed 2010·Granted Nov 5, 2013·4 cites·13 claims
- 1079US12057362B2Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·19 claims
- 1172US8446008B2Semiconductor device bonding with stress relief connection padsKASAI MASAKI·Filed 2007·Granted May 21, 2013·5 cites·4 claims
- 1267US8164201B2Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulusKASAI MASAKI·Filed 2006·Granted Apr 24, 2012·3 cites·21 claims
- 1362US2025055176A1Electronic component module and wireless communication device comprising sameMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1458US2024364307A1Acoustic wave filter deviceMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1555US8723339B2Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulusROHM CO LTD·Filed 2013·Granted May 13, 2014·0 cites·22 claims
- 1651US8664779B2Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulusKASAI MASAKI·Filed 2012·Granted Mar 4, 2014·0 cites·22 claims
- 1750US9018762B2Semiconductor device bonding with stress relief connection padsROHM CO LTD·Filed 2013·Granted Apr 28, 2015·0 cites·11 claims
- 1841US2008272488A1Semiconductor DeviceROHM CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →