Inventor · disambiguated record
Masato Kishi
Also filed as: KISHI MASATO
8 granted patents·4 pending applications·17 citations·filing 1979–2020
78Inventor score
Files withSHINDENGEN ELECTRIC MFG3LINTEC CORP2NEC CORP2NIPPON PAINT SURF CHEMICALS CO LTD2AISIN CORP1
Top patents by PatentIndex Score
12 records- 0153US7385393B2Magnetic field measuring apparatus capable of measuring at high spatial resolutionNEC CORP·Filed 2004·Granted Jun 10, 2008·5 cites·4 claims
- 0251US10465101B2Adhesive sheet and method for producing adhesive sheetLINTEC CORP·Filed 2015·Granted Nov 5, 2019·0 cites·18 claims
- 0350US2020131642A1Treatment method using zinc phosphate-free treatment agent that includes cationic urethane resin, and treated automobile componentNIPPON PAINT SURF CHEMICALS CO LTD·Filed 2018·Application pending·0 cites
- 0449US9109977B2Optical fiber characteristics measurement device and methodKISHI MASATO·Filed 2012·Granted Aug 18, 2015·1 cites·5 claims
- 0548US2020165741A1Chemical conversion treatment agent, coating pre-treatment method, and metal memberNIPPON PAINT SURF CHEMICALS CO LTD·Filed 2018·Application pending·0 cites
- 0646US4216037AMethod for manufacturing a heterojunction semiconductor device by disappearing intermediate layerKATODA TAKASHI·Filed 1979·Granted Aug 5, 1980·11 cites·3 claims
- 0745US11519406B2Oil pump having housing with seal portionAISIN CORP·Filed 2020·Granted Dec 6, 2022·0 cites·4 claims
- 0845US10363718B2Adhesive sheet and adhesive sheet production methodLINTEC CORP·Filed 2015·Granted Jul 30, 2019·0 cites·18 claims
- 0944US2008238419A1Magnetic field measuring apparatus capable of measuring at high spatial resolutionNEC CORP·Filed 2008·Application pending·0 cites
- 1034US9831337B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2015·Granted Nov 28, 2017·0 cites·9 claims
- 1132US9831335B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2015·Granted Nov 28, 2017·0 cites·9 claims
- 1227US2020295179A1Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →