Inventor · disambiguated record
Masayuki Kiso
Also filed as: KISO MASAYUKI
13 granted patents·5 pending applications·673 citations·filing 1986–2020
92Inventor score
Files withUEMURA KOGYO KK11UYEMURA C & CO LTD4INAGAWA HIROMU1KUROSAKA SEIGO1UYEMURA AND COMPANY LIMITED C1
Top patents by PatentIndex Score
18 records- 0195US5248527AProcess for electroless plating tin, lead or tin-lead alloyUYEMURA AND COMPANY LIMITED C·Filed 1992·Granted Sep 28, 1993·288 cites·13 claims
- 0294US5910340AElectroless nickel plating solution and methodUYEMURA C & CO LTD·Filed 1997·Granted Jun 8, 1999·307 cites·2 claims
- 0381US11173513B2Surface treatment device comprising a paddle for stirring a surface treatment solution, paddle for stirring a surface treatment solution and method thereofUEMURA KOGYO KK·Filed 2019·Granted Nov 16, 2021·2 cites·9 claims
- 0475US8292993B2Electroless nickel plating bath and method for electroless nickel platingINAGAWA HIROMU·Filed 2009·Granted Oct 23, 2012·4 cites·7 claims
- 0566US4913787AGold plating bath and methodUEMURA KOGYO KK·Filed 1989·Granted Apr 3, 1990·13 cites·9 claims
- 0664US8124174B2Electroless gold plating method and electronic partsKUROSAKA SEIGO·Filed 2008·Granted Feb 28, 2012·2 cites·6 claims
- 0764US5266103ABath and method for the electroless plating of tin and tin-lead alloyUEMURA KOGYO KK·Filed 1992·Granted Nov 30, 1993·25 cites·12 claims
- 0856US7988773B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Aug 2, 2011·0 cites·11 claims
- 0955US11891698B2Turbulence-reducing device for stirring a surface treatment solutionUEMURA KOGYO KK·Filed 2020·Granted Feb 6, 2024·0 cites·6 claims
- 1054US7985285B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Jul 26, 2011·0 cites·11 claims
- 1154US2020095698A1Electrolytic tin plating solutionUEMURA KOGYO KK·Filed 2019·Application pending·0 cites
- 1252US2020123673A1Electrolytic tin alloy plating solutionUEMURA KOGYO KK·Filed 2019·Application pending·0 cites
- 1352US2021172084A1Method for reproducing plating solutionUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
- 1450US4792469AElectroless gold plating solutionUEMURA KOGYO KK·Filed 1986·Granted Dec 20, 1988·13 cites·15 claims
- 1548US2020208285A1Electrolytic sn or sn alloy plating solution and method for producing sn or sn alloy plated articleUEMURA KOGYO KK·Filed 2018·Application pending·0 cites
- 1648US2008173550A1Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performanceUYEMURA C & CO LTD·Filed 2008·Application pending·0 cites
- 1744US5294554AAnalysis of tin, lead or tin-lead alloy plating solutionUEMURA KOGYO KK·Filed 1992·Granted Mar 15, 1994·10 cites·25 claims
- 1843US5234572AMetal ion replenishment to plating bathUEMURA KOGYO KK·Filed 1992·Granted Aug 10, 1993·9 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →