Inventor · disambiguated record
Masateru Koide
Also filed as: KOIDE MASATERU
22 granted patents·4 pending applications·184 citations·filing 1994–2018
94Inventor score
Top patents by PatentIndex Score
26 records- 0188US5670067AApparatus for laser cutting wiring in accordance with a measured size of the wiringFUJITSU LTD·Filed 1994·Granted Sep 23, 1997·56 cites·36 claims
- 0285US5550083AProcess of wirebond pad repair and reuseFUJITSU LTD·Filed 1995·Granted Aug 27, 1996·72 cites·10 claims
- 0380US9699887B2Circuit board and electronic deviceFUJITSU LTD·Filed 2014·Granted Jul 4, 2017·6 cites·16 claims
- 0479US8289728B2Interconnect board, printed circuit board unit, and methodKOIDE MASATERU·Filed 2010·Granted Oct 16, 2012·6 cites·8 claims
- 0578US8446020B2Multi-chip moduleKOIDE MASATERU·Filed 2010·Granted May 21, 2013·5 cites·8 claims
- 0675US8546187B2Electronic part and method of manufacturing the sameKOIDE MASATERU·Filed 2010·Granted Oct 1, 2013·4 cites·6 claims
- 0774US7915541B2Multilayer interconnection substrate and manufacturing method thereforFUJITSU LTD·Filed 2008·Granted Mar 29, 2011·5 cites·7 claims
- 0871US8740047B2Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the sameFUJITSU LTD·Filed 2013·Granted Jun 3, 2014·2 cites·3 claims
- 0966US8556157B2Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the sameSAKUYAMA SEIKI·Filed 2011·Granted Oct 15, 2013·2 cites·8 claims
- 1066US7268002B2Packaging method, packaging structure and package substrate for electronic partsFUJITSU LTD·Filed 2005·Granted Sep 11, 2007·3 cites·9 claims
- 1165US8811031B2Multichip module and method for manufacturing the sameKOIDE MASATERU·Filed 2010·Granted Aug 19, 2014·2 cites·10 claims
- 1261US8368230B2Electronic part and method of manufacturing the sameFUJITSU LTD·Filed 2010·Granted Feb 5, 2013·1 cites·5 claims
- 1355US8866270B2Method of manufacturing semiconductor device mounting structureFUJITSU LTD·Filed 2014·Granted Oct 21, 2014·0 cites·1 claims
- 1454US8716839B2Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatusFUJITSU LTD·Filed 2013·Granted May 6, 2014·0 cites·6 claims
- 1551US7057272B2Power supply connection structure to a semiconductor deviceFUJITSU LTD·Filed 2004·Granted Jun 6, 2006·3 cites·11 claims
- 1649US7291901B2Packaging method, packaging structure and package substrate for electronic partsFUJITSU LTD·Filed 2004·Granted Nov 6, 2007·3 cites·9 claims
- 1747US5455461ASemiconductor device having reformed padFUJITSU LTD·Filed 1994·Granted Oct 3, 1995·13 cites·10 claims
- 1846US9515005B2Package mounting structureFUJITSU LTD·Filed 2014·Granted Dec 6, 2016·0 cites·6 claims
- 1946US2009079062A1Semiconductor package and electronic deviceFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2045US10181437B2Package substrate and method of manufacturing package substrateFUJITSU LTD·Filed 2018·Granted Jan 15, 2019·0 cites·4 claims
- 2145US7301230B2Circuit board with a thin-film layer configured to accommodate a passive elementFUJITSU LTD·Filed 2004·Granted Nov 27, 2007·1 cites·4 claims
- 2244US11317520B2Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2018·Granted Apr 26, 2022·0 cites·8 claims
- 2344US2007262427A1Semiconductor deviceFUJITSU LTD·Filed 2007·Application pending·0 cites
- 2443US2011080717A1Interconnect board, printed circuit board unit, and methodFUJITSU LTD·Filed 2010·Application pending·0 cites
- 2542US2007228530A1Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreaderFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2637US10396020B2Method of manufacturing boardFUJITSU LTD·Filed 2018·Granted Aug 27, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →