Inventor · disambiguated record
Masahiro Koizumi
Also filed as: KOIZUMI MASAHIRO
38 granted patents·5 pending applications·1,207 citations·filing 1983–2018
98Inventor score
Files withHITACHI LTD10FURUKAWA ROCK DRILL CO LTD5RENESAS TECH CORP4KAJIWARA RYOICHI3SEGA ENTERPRISES KK3
Top patents by PatentIndex Score
43 records- 0198US6774466B1Semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 10, 2004·162 cites·2 claims
- 0296US6798072B2Flip chip assembly structure for semiconductor device and method of assembling thereforHITACHI LTD·Filed 2001·Granted Sep 28, 2004·144 cites·12 claims
- 0394US7985991B2MOSFET packageRENESAS ELECTRONICS CORP·Filed 2008·Granted Jul 26, 2011·16 cites·30 claims
- 0491US8183607B2Semiconductor deviceKAJIWARA RYOICHI·Filed 2011·Granted May 22, 2012·8 cites·4 claims
- 0590US7400002B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Jul 15, 2008·11 cites·20 claims
- 0690US7332757B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·8 claims
- 0789US7342267B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Mar 11, 2008·10 cites·48 claims
- 0889US6784554B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Aug 31, 2004·49 cites·10 claims
- 0989US6434008B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·84 cites·11 claims
- 1089US5956231ASemiconductor device having power semiconductor elementsHITACHI LTD·Filed 1995·Granted Sep 21, 1999·85 cites·20 claims
- 1189US4965656ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Oct 23, 1990·84 cites·12 claims
- 1288US6578778B2Fuel injection valveAISAN IND·Filed 2001·Granted Jun 17, 2003·31 cites·3 claims
- 1388USD448824SColored translucent golf driver headFiled 2000·Granted Oct 2, 2001·121 cites·1 claims
- 1486US10493610B2Hydraulic hammering deviceFURUKAWA ROCK DRILL CO LTD·Filed 2015·Granted Dec 3, 2019·6 cites·7 claims
- 1586US8455986B2Mosfet packageKAJIWARA RYOICHI·Filed 2012·Granted Jun 4, 2013·4 cites·12 claims
- 1685US6569764B1Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin materialHITACHI LTD·Filed 2000·Granted May 27, 2003·43 cites·5 claims
- 1784US11072977B2Two-piston hydraulic striking deviceFURUKAWA ROCK DRILL CO LTD·Filed 2017·Granted Jul 27, 2021·4 cites·20 claims
- 1882US8816411B2Mosfet packageRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 26, 2014·3 cites·8 claims
- 1981US5884835AUltrasonic bonding method and ultrasonic bonding apparatusHITACHI LTD·Filed 1996·Granted Mar 23, 1999·60 cites·8 claims
- 2078US7394146B2MOSFET packageRENESAS TEHCNOLOGY CORP·Filed 2006·Granted Jul 1, 2008·5 cites·30 claims
- 2172US6524680B1Honeycomb structureNICHIAS CORP·Filed 2000·Granted Feb 25, 2003·14 cites·10 claims
- 2271US8793851B2Retainer assembling apparatus and retainer assembling methodSHIGA HIROYUKI·Filed 2012·Granted Aug 5, 2014·5 cites·4 claims
- 2369US7649159B2Apparatus and a method of soldering a part to a boardTOYOTA MOTOR CO LTD·Filed 2006·Granted Jan 19, 2010·5 cites·10 claims
- 2469US7141741B2Circuit boardHITACHI HARAMACHI ELECTRONICS·Filed 2003·Granted Nov 28, 2006·12 cites·1 claims
- 2569US5630170ASystem and method for determining peripheral's communication mode over row of pins disposed in a socket connectorSEGA ENTERPRISES KK·Filed 1995·Granted May 13, 1997·68 cites·61 claims
- 2669US4976393ASemiconductor device and production process thereof, as well as wire bonding device used thereforHITACHI LTD·Filed 1987·Granted Dec 11, 1990·40 cites·33 claims
- 2767US11207769B2Hydraulic hammering deviceFURUKAWA ROCK DRILL CO LTD·Filed 2018·Granted Dec 28, 2021·1 cites·16 claims
- 2865US9926998B2Piston structure for engineMAZDA MOTOR·Filed 2013·Granted Mar 27, 2018·2 cites·3 claims
- 2962US5892974ASystem for sub-data processor identifies the peripheral from supplied identification data and supplies data indicative of the kind of peripheral to main data processorSEGA ENTERPRISES KK·Filed 1995·Granted Apr 6, 1999·45 cites·38 claims
- 3062US5872999ASystem for peripheral identification obtained by calculation and manipulation data collecting for determining communication mode and collecting data from first terminal contactsSEGA ENTERPRISES KK·Filed 1995·Granted Feb 16, 1999·42 cites·24 claims
- 3159US9672752B2Learning assistance server, learning assistance system, and learning assistance programFLENS INC·Filed 2012·Granted Jun 6, 2017·2 cites·2 claims
- 3253US11052524B2Hydraulic hammering deviceFURUKAWA ROCK DRILL CO LTD·Filed 2016·Granted Jul 6, 2021·0 cites·16 claims
- 3353US4912544ACorrosion-resistant aluminum electronic materialHITACHI LTD·Filed 1983·Granted Mar 27, 1990·16 cites·9 claims
- 3453US2007029540A1Semiconductor deviceKAJIWARA RYOICHI·Filed 2006·Application pending·0 cites
- 3551US7942216B2Drill rod, drill bit, and drilling toolMITSUBISHI MATERIALS CORP·Filed 2006·Granted May 17, 2011·3 cites·8 claims
- 3645US4699115AIgnition apparatus for internal combustion enginesNIPPON DENSO CO·Filed 1986·Granted Oct 13, 1987·6 cites·6 claims
- 3744US2004217474A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 3843US2004150082A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 3940US11034010B2Hydraulic hammering deviceFURUKAWA ROCK DRILL CO LTD·Filed 2016·Granted Jun 15, 2021·0 cites·14 claims
- 4040US10865857B2Accessory drive device for engineMAZDA MOTOR·Filed 2017·Granted Dec 15, 2020·0 cites·4 claims
- 4139US2003016502A1Semiconductor deviceFiled 2002·Application pending·0 cites
- 4237US2003001286A1Semiconductor package and flip chip bonding method thereinFiled 2002·Application pending·0 cites
- 4333US5153704ASemiconductor device using annealed bonding wireHITACHI LTD·Filed 1992·Granted Oct 6, 1992·5 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →