Inventor · disambiguated record
Masatoshi Kunieda
Also filed as: KUNIEDA MASATOSHI
18 granted patents·11 pending applications·65 citations·filing 2010–2025
91Inventor score
Top patents by PatentIndex Score
29 records- 0194US9431347B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 30, 2016·28 cites·20 claims
- 0289US9425159B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 23, 2016·12 cites·20 claims
- 0383US9706663B2Printed wiring board, method for manufacturing the same and semiconductor deviceIBIDEN CO LTD·Filed 2015·Granted Jul 11, 2017·4 cites·18 claims
- 0482US8698303B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceFURUTANI TOSHIKI·Filed 2011·Granted Apr 15, 2014·6 cites·7 claims
- 0579US9066435B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Jun 23, 2015·4 cites·20 claims
- 0678US8487192B2Printed wiring board and method for manufacturing the sameKUNIEDA MASATOSHI·Filed 2010·Granted Jul 16, 2013·7 cites·18 claims
- 0766US9613893B2Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 0861US12150244B2Wiring substrate having optical waveguideIBIDEN CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 0961US2024272355A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1061US2024255695A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1160US9565756B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Feb 7, 2017·1 cites·20 claims
- 1259US12089330B2Wiring substrateIBIDEN CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 1358US9532468B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Dec 27, 2016·1 cites·20 claims
- 1455US9338886B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceIBIDEN CO LTD·Filed 2014·Granted May 10, 2016·0 cites·20 claims
- 1554US9433085B2Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·20 claims
- 1654US8785255B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceIBIDEN CO LTD·Filed 2014·Granted Jul 22, 2014·0 cites·7 claims
- 1752US2025216614A1Wiring substrateIBIDEN CO LTD·Filed 2025·Application pending·0 cites
- 1851US2014347837A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 1945US2015264817A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 2045US2015060127A1Combined printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 2145US2015060124A1Combined printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 2244US2014102768A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Application pending·0 cites
- 2343US2018154317A1Filter membraneIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 2441US11071945B2Filter membraneIBIDEN CO LTD·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 2537US9935029B2Printed wiring board for package-on-packageIBIDEN CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·20 claims
- 2636US8546922B2Wiring boardFURUTANI TOSHIKI·Filed 2011·Granted Oct 1, 2013·0 cites·20 claims
- 2734US2016100482A1Printed wiring board with metal post and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 2834US2016100484A1Printed wiring board with bump and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 2928US9986642B2Method for manufacturing printed wiring board and printed wiring boardIBIDEN CO LTD·Filed 2016·Granted May 29, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →