Inventor · disambiguated record
Marvin Liao
Also filed as: LIAO MARVIN · LIAO MARVIN DE-DUI
10 granted patents·2 pending applications·269 citations·filing 1996–2004
92Inventor score
Top patents by PatentIndex Score
12 records- 0188US6500742B1Construction of a film on a semiconductor waferAPPLIED MATERIALS INC·Filed 2000·Granted Dec 31, 2002·36 cites·33 claims
- 0286US5834068AWafer surface temperature control for deposition of thin filmsAPPLIED MATERIALS INC·Filed 1996·Granted Nov 10, 1998·73 cites·14 claims
- 0380US6291343B1Plasma annealing of substrates to improve adhesionAPPLIED MATERIALS INC·Filed 1998·Granted Sep 18, 2001·45 cites·24 claims
- 0477US7067869B2Adjustable 3D capacitorCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Jun 27, 2006·23 cites·15 claims
- 0571US6444036B2Construction of a film on a semiconductor waferAPPLIED MATERIALS INC·Filed 2000·Granted Sep 3, 2002·13 cites·11 claims
- 0668US6155198AApparatus for constructing an oxidized film on a semiconductor waferAPPLIED MATERIALS INC·Filed 1996·Granted Dec 5, 2000·29 cites·15 claims
- 0757US6689643B2Adjustable 3D capacitorCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Feb 10, 2004·7 cites·13 claims
- 0856US6127238APlasma enhanced chemical vapor deposited (PECVD) silicon nitride barrier layer for high density plasma chemical vapor deposited (HDP-CVD) dielectric layerCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Oct 3, 2000·21 cites·9 claims
- 0955US6251758B1Construction of a film on a semiconductor waferAPPLIED MATERIALS INC·Filed 1997·Granted Jun 26, 2001·11 cites·40 claims
- 1047US6699530B2Method for constructing a film on a semiconductor waferAPPLIED MATERIALS INC·Filed 1997·Granted Mar 2, 2004·11 cites·10 claims
- 1142US2004099215A1Chamber for constructing a film on a semiconductor waferAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1228US2002033533A1Interconnect structure for use in an integrated circuitFiled 1997·Application pending·0 cites
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