Inventor · disambiguated record
Mauro Mazzola
Also filed as: MAZZOLA MAURO
11 granted patents·16 pending applications·28 citations·filing 1995–2025
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
27 records- 0171US10872845B2Process for manufacturing a flip chip semiconductor package and a corresponding flip chip packageST MICROELECTRONICS SRL·Filed 2018·Granted Dec 22, 2020·2 cites·14 claims
- 0268US6592352B1Offset edges mold for plastic packaging of integrated semiconductor devicesST MICROELECTRONICS SRL·Filed 2000·Granted Jul 15, 2003·18 cites·19 claims
- 0368US2024266259A1Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and toolST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 0462US11967544B2Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and toolST MICROELECTRONICS SRL·Filed 2021·Granted Apr 23, 2024·0 cites·14 claims
- 0562US10141197B2Thermosonically bonded connection for flip chip packagesST MICROELECTRONICS SRL·Filed 2016·Granted Nov 27, 2018·1 cites·21 claims
- 0659US2025014982A1Method of manufacturing semiconductor devices, corresponding pre-molded leadframe and semiconductor deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0758US2024355714A1Method of manufacturing semiconductor devices, corresponding substrate and semiconductor deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0858US2025079386A1Method of manufacturing semiconductor devices, corresponding component and semiconductor deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0957US2024178105A1Method of manufacturing substrates for semiconductor devices, corresponding product and semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 1056US2024194570A1Method of manufacturing semiconductor devices, corresponding substrate and semiconductor deviceST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 1156US2024178179A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 1256US2024145355A1Method of manufacturing semiconductor devices, corresponding component, semiconductor device and methodST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 1356US2024250058A1Method of manufacturing semiconductor devices, corresponding ribbon, apparatus and deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1454US2024145351A1Method of manufacturing semiconductor devices, corresponding semiconductor device, assembly and support substrateST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 1552US12456629B2Method of producing substrates for semiconductor device packages comprising anchoring encapsulation to die padST MICROELECTRONICS SRL·Filed 2022·Granted Oct 28, 2025·0 cites·10 claims
- 1651US12463170B2Semiconductor device and assortment of semiconductor devices with electrically conductive ribbon configurationsST MICROELECTRONICS SRL·Filed 2022·Granted Nov 4, 2025·0 cites·11 claims
- 1751US7084003B2Method for manufacturing semiconductor device packagesST MICROELECTRONICS SRL·Filed 2002·Granted Aug 1, 2006·6 cites·10 claims
- 1851US2023245955A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 1950US11557547B2Leadframe for semiconductor devices, corresponding semiconductor product and methodST MICROELECTRONICS SRL·Filed 2020·Granted Jan 17, 2023·0 cites·22 claims
- 2050US10741415B2Thermosonically bonded connection for flip chip packagesST MICROELECTRONICS SRL·Filed 2018·Granted Aug 11, 2020·0 cites·19 claims
- 2150US2023005824A1Method of manufacturing substrates for semiconductor devices, corresponding substrate and semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 2250US2023031682A1Method of manufacturing substrates for semiconductor devices, corresponding substrate and semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 2350US2023031422A1Method of manufacturing substrates for semiconductor devices, corresponding substrate and semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 2448US2022199500A1Method of manufacturing semiconductor devices, component for use therein and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2021·Application pending·0 cites
- 2546US2025300126A1Method of manufacturing semiconductor devices and corresponding deviceST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 2627US5852324APlastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modesSGS THOMSON MICROELECTRONICS·Filed 1997·Granted Dec 22, 1998·1 cites·15 claims
- 2727US5617295ALeadframe for supporting integrated semiconductor devicesST MICROELECTRONICS SRL·Filed 1995·Granted Apr 1, 1997·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →