Inventor · disambiguated record
Mark Thomas Mccormack
Also filed as: MCCORMACK MARK · MCCORMACK MARK T · MCCORMACK MARK THOMAS
42 granted patents·3 pending applications·2,306 citations·filing 1992–2019
99Inventor score
Files withFUJITSU LTD17LUCENT TECHNOLOGIES INC10AT & T CORP7MICROSOFT TECHNOLOGY LICENSING LLC3INTEL CORP2
Top patents by PatentIndex Score
45 records- 0199US6684007B2Optical coupling structures and the fabrication processesFUJITSU LTD·Filed 2001·Granted Jan 27, 2004·249 cites·4 claims
- 0297US6603915B2Interposer and method for producing a light-guiding structureFUJITSU LTD·Filed 2001·Granted Aug 5, 2003·201 cites·14 claims
- 0397US6572780B2Methods for fabricating flexible circuit structuresFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·99 cites·7 claims
- 0497US6544430B2Methods for detaching a layer from a substrateFUJITSU LTD·Filed 2001·Granted Apr 8, 2003·118 cites·8 claims
- 0596US6882045B2Multi-chip module and method for forming and method for deplating defective capacitorsFiled 2001·Granted Apr 19, 2005·99 cites·9 claims
- 0696US6521530B2Composite interposer and method for producing a composite interposerFUJITSU LTD·Filed 2001·Granted Feb 18, 2003·237 cites·37 claims
- 0795US6669801B2Device transfer methodFUJITSU LTD·Filed 2001·Granted Dec 30, 2003·106 cites·67 claims
- 0895US6054761AMulti-layer circuit substrates and electrical assemblies having conductive composition connectorsFUJITSU LTD·Filed 1998·Granted Apr 25, 2000·103 cites·38 claims
- 0993US6326555B1Method and structure of z-connected laminated substrate for high density electronic packagingFUJITSU LTD·Filed 1999·Granted Dec 4, 2001·93 cites·44 claims
- 1092US6163957AMultilayer laminated substrates with high density interconnects and methods of making the sameFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·138 cites·19 claims
- 1192US5549977AArticle comprising magnetoresistive materialLUCENT TECHNOLOGIES INC·Filed 1994·Granted Aug 27, 1996·70 cites·18 claims
- 1291US6859587B2Method and apparatus for wafer level testing of integrated optical waveguide circuitsINTEL CORP·Filed 2001·Granted Feb 22, 2005·34 cites·14 claims
- 1388US6271107B1Semiconductor with polymeric layerFUJITSU LTD·Filed 1999·Granted Aug 7, 2001·95 cites·33 claims
- 1488US5509815ASolder medium for circuit interconnectionAT & T CORP·Filed 1994·Granted Apr 23, 1996·59 cites·47 claims
- 1587US5698160ALead-free alloys for use in solder bondingLUCENT TECHNOLOGIES INC·Filed 1996·Granted Dec 16, 1997·39 cites·4 claims
- 1687US5569433ALead-free low melting solder with improved mechanical propertiesLUCENT TECHNOLOGIES INC·Filed 1994·Granted Oct 29, 1996·51 cites·2 claims
- 1785US5538686AArticle comprising a PB-free solder having improved mechanical propertiesAT & T CORP·Filed 1994·Granted Jul 23, 1996·45 cites·5 claims
- 1885US5346775AArticle comprising solder with improved mechanical propertiesAT & T LAB·Filed 1993·Granted Sep 13, 1994·79 cites·12 claims
- 1981US7513037B2Method of embedding components in multi-layer circuit boardsFUJITSU LTD·Filed 2005·Granted Apr 7, 2009·9 cites·11 claims
- 2081US6759257B2Structure and method for embedding capacitors in z-connected multi-chip modulesFUJITSU LTD·Filed 2001·Granted Jul 6, 2004·27 cites·14 claims
- 2181US5846366AMethod for interconnecting an electronic device using a transferable solder carrying mediumLUCENT TECHNOLOGIES INC·Filed 1996·Granted Dec 8, 1998·46 cites·5 claims
- 2278US5834709APosition sensing systems including magnetoresistive elementsLUCENT TECHNOLOGIES INC·Filed 1994·Granted Nov 10, 1998·31 cites·14 claims
- 2375US6428942B1Multilayer circuit structure build up methodFUJITSU LTD·Filed 1999·Granted Aug 6, 2002·32 cites·63 claims
- 2472US9661770B2Graphic formation via material ablationMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2013·Granted May 23, 2017·3 cites·20 claims
- 2572US5762866AArticle comprising a Pb-free solder having improved mechanical propertiesLUCENT TECHNOLOGIES INC·Filed 1995·Granted Jun 9, 1998·21 cites·2 claims
- 2672US5747918ADisplay apparatus comprising diamond field emittersLUCENT TECHNOLOGIES INC·Filed 1995·Granted May 5, 1998·24 cites·13 claims
- 2767US5618189ASolder medium for circuit interconnectionLUCENT TECHNOLOGIES INC·Filed 1996·Granted Apr 8, 1997·41 cites·17 claims
- 2867US5591037AMethod for interconnecting an electronic device using a removable solder carrying mediumLUCENT TECHNOLOGIES INC·Filed 1994·Granted Jan 7, 1997·35 cites·9 claims
- 2966US5411814AArticle comprising magnetoresistive oxide of La, Ca, Mn additionally containing either of both of Sr and BaAT & T CORP·Filed 1994·Granted May 2, 1995·19 cites·14 claims
- 3061US6579474B2Conductive compositionFUJITSU LTD·Filed 2001·Granted Jun 17, 2003·6 cites·20 claims
- 3160US5461308AMagnetoresistive current sensor having high sensitivityAT & T CORP·Filed 1993·Granted Oct 24, 1995·20 cites·8 claims
- 3258US9563233B2Electronic device with plated electrical contactMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2014·Granted Feb 7, 2017·1 cites·19 claims
- 3354US6866741B2Method for joining large substratesFUJITSU LTD·Filed 2001·Granted Mar 15, 2005·5 cites·21 claims
- 3454US5538800AMagnetoresistive oxide material and articles comprising the materialAT & T CORP·Filed 1994·Granted Jul 23, 1996·11 cites·8 claims
- 3552US7199307B2Structure and method for embedding capacitors in z-connected multi-chip modulesFUJITSU LTD·Filed 2004·Granted Apr 3, 2007·6 cites·5 claims
- 3651US5450372AMagnetoresistive microphone and acoustic sensing devicesAT & T CORP·Filed 1994·Granted Sep 12, 1995·13 cites·10 claims
- 3750US5512818AVoltage proportional replication device using magnetoresistive sensing elementsAT & T CORP·Filed 1994·Granted Apr 30, 1996·17 cites·14 claims
- 3847US7386197B2Method and apparatus for wafer level testing of integrated optical waveguide circuitsINTEL CORP·Filed 2004·Granted Jun 10, 2008·2 cites·1 claims
- 3946US10910281B2Integrated circuit metallic ion diffusion defect validationMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 4045US5560752AProcess for activation of metal hydridesLUCENT TECHNOLOGIES INC·Filed 1994·Granted Oct 1, 1996·10 cites·22 claims
- 4140US6281040B1Methods for making circuit substrates and electrical assembliesFUJITSU LTD·Filed 1999·Granted Aug 28, 2001·6 cites·89 claims
- 4239US2002119396A1Structure and method for forming z-laminated multilayered packaging substrateFiled 2001·Application pending·0 cites
- 4338US2002175402A1Structure and method of embedding components in multi-layer substratesFiled 2001·Application pending·0 cites
- 4435US2002151164A1Structure and method for depositing solder bumps on a waferFiled 2001·Application pending·0 cites
- 4534US5328550AThinning a diamond body by means of molten rare-earth-containing alloysAT & T BELL LAB·Filed 1992·Granted Jul 12, 1994·6 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →