US2002119396A1PendingUtilityA1

Structure and method for forming z-laminated multilayered packaging substrate

39
Priority: Oct 28, 1999Filed: Sep 18, 2001Published: Aug 29, 2002
Est. expiryOct 28, 2019(expired)· nominal 20-yr term from priority
Inventors:Hunt Hang JiangMark Thomas MccormackAlbert W. ChanKuo-Chuan Liu
H05K 2203/1383H05K 3/4647H05K 3/243H05K 2203/0733H05K 3/4602H05K 3/108H05K 2203/066H05K 3/0035H10W 90/724H10W 72/0198H10P 72/743H10W 70/095
39
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Claims

Abstract

A method for forming a plurality of solder bumps comprising providing a pair of metallic supports. An initial solder layer is respectively disposed on each of the metallic supports which may be a metal-filled blind via. One or two additional solder layers are disposed on one of the initial solder layers. A multilayered packaging assembly includes the solder layer(s) on a plurality of substrates which are coupled together.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A method for forming a solder bump on a metal comprising: 
 providing a metallic support;    depositing a first solder layer on the metallic support; and    depositing a second solder layer on the first solder layer.    
     
     
         2 . The method of  claim 1  additionally comprising depositing a third solder layer on the second solder layer.  
     
     
         3 . The method of  claim 1  wherein said first solder layer comprises a first solder composition and said second layer comprises a second solder composition which is generally different than said first solder composition.  
     
     
         4 . The method of  claim 2  wherein said third solder layer comprises a third solder composition.  
     
     
         5 . The method of  claim 4  wherein said third solder composition is generally different than said second solder composition.  
     
     
         6 . The method of  claim 4  wherein said third solder composition is generally equal to said first solder composition.  
     
     
         7 . The method of  claim 3  wherein said first solder composition comprises a major proportion of tin and a minor proportion of lead, and said second solder composition comprises a major proportion of lead and a minor proportion of tin.  
     
     
         8 . The method of  claim 4  wherein said first solder composition comprises a major proportion of tin and a minor proportion of lead, said second solder composition comprises a major proportion of lead and a minor proportion of tin, and said third solder composition comprises a major proportion of tin and a minor proportion of lead.  
     
     
         9 . The method of  claim 8  wherein said metallic support comprises a metal-filled via in a laminated substrate.  
     
     
         10 . The method of  claim 9  wherein said metal-filled via comprises a blind via having a generally frusto-conical shape in vertical cross section.  
     
     
         11 . A method for forming a plurality of solder bumps comprising providing a first metallic support; providing a second metallic support; depositing a first solder layer on the first metallic support; depositing a second solder layer on the first solder layer; and depositing a third solder layer on the second metallic support.  
     
     
         12 . The method of  claim 11  additionally comprising depositing a fourth solder layer on the second solder layer.  
     
     
         13 . The method of  claim 11  wherein said first solder layer comprises a first solder composition and said second solder layer comprises a second solder composition which is generally different than said first solder composition.  
     
     
         14 . The method of  claim 12  wherein said fourth solder layer comprises a fourth solder composition.  
     
     
         15 . The method of  claim 14  wherein said fourth solder composition is generally different than said second solder composition.  
     
     
         16 . The method of  claim 14  wherein said fourth solder composition is generally equal to said first solder composition.  
     
     
         17 . The method of  claim 13  wherein said first solder composition comprises a major proportion of tin and a minor proportion of lead, and said second solder composition comprises a major proportion of lead and a minor proportion of tin.  
     
     
         18 . The method of  claim 14  wherein said first solder composition comprises a major proportion of tin and a minor proportion of lead, said second solder composition comprises a major proportion of lead and a minor proportion of tin, and said fourth solder composition comprises a major proportion tin and a minor proportion of lead.  
     
     
         19 . The method of  claim 18  wherein said first metallic support comprises a first metal-filled via in a first laminated substrate.  
     
     
         20 . The method of  claim 19  wherein said first metal-filled via comprises a first blind via having a generally frusto-conical shape in vertical cross section.  
     
     
         21 . The method of  claim 13  wherein said third solder layer comprises a third solder composition which is generally different than said second solder composition.  
     
     
         22 . The method of  claim 21  wherein said first solder composition comprises a major proportion of tin and a minor proportion of lead, and said second solder composition comprises a major proportion of lead and a minor proportion of tin.  
     
     
         23 . The method of  claim 21  wherein said first solder composition comprises a major proportion of tin and a minor proportion of lead, said second solder composition comprises a major proportion of lead and a minor proportion of tin, and said third solder composition comprises a major proportion of tin and a minor proportion of lead.  
     
     
         24 . The method of  claim 21  wherein said first solder composition consists of tin having a first thickness, said second solder composition consists of gold having a second thickness greater than the first thickness, and said third solder composition consists of tin having a third thickness less than said second thickness.  
     
     
         25 . The method of  claim 19  wherein said second metallic support comprises a second metal-filled via in a second laminated substrate which is coupled to said first laminated substrate.  
     
     
         26 . A method for forming a multilayered packaging assembly comprising: 
 forming a first metallic support on a first substrate;    forming a second metallic support on a second substrate;    depositing a first solder layer on the first metallic support;    depositing a second solder layer on the first solder layer; and    coupling the second solder layer to the second metallic support.    
     
     
         27 . The method of  claim 26  additionally comprising rotating the second substrate 180 degrees prior to said coupling.  
     
     
         28 . The method of  claim 26  additionally comprising heating the first solder layer to a temperature higher than its melting point temperature but below a melting point temperature of the second solder layer.  
     
     
         29 . The method of  claim 26  additionally depositing a third solder layer on said second solder layer.  
     
     
         30 . The method of  claim 29  additionally comprising heating the first substrate to a temperature higher than a melting temperature of the first and third solder layers but below a melting point temperature of the second solder layer.  
     
     
         31 . A substrate assembly comprising a substrate having a metallic member; a first solder layer disposed on the metallic member; and a second solder layer disposed on the first solder layer.  
     
     
         32 . A multilayered packaging assembly comprising a first substrate having a first metallic support; a first solder layer disposed on the first metallic support; a second solder layer disposed on the first solder layer; a third solder layer disposed on the second solder layer; and a second substrate having a second metallic support and coupled to the first substrate.  
     
     
         33 . The method of  claim 30  additionally comprising heating the first substrate to a temperature greater than the melting point temperature of the second solder layer.  
     
     
         34 . The method of  claim 33  additionally comprising a bonding sheet supported by said first substrate.  
     
     
         35 . The method of  claim 34  additionally comprising cooling the first substrate to a temperature which approximates a curing temperature of the bonding sheet.

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