Inventor · disambiguated record
Manfred Mengel
Also filed as: MENGEL MANFRED · PUPPE LOTHAR
57 granted patents·12 pending applications·202 citations·filing 1975–2021
98Inventor score
Top patents by PatentIndex Score
69 records- 0192US11641779B2Thermoelectric devices and methods for forming thermoelectric devicesINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 2, 2023·2 cites·8 claims
- 0290US9048338B2Device including two power semiconductor chips and manufacturing thereofHOSSEINI KHALIL·Filed 2011·Granted Jun 2, 2015·12 cites·5 claims
- 0390US8507320B2Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Aug 13, 2013·17 cites·10 claims
- 0483US9437513B2Electrically insulating thermal interface on the discontinuity of an encapsulation structureINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 6, 2016·5 cites·8 claims
- 0583US9021887B2Micromechanical semiconductor sensing deviceKALZ FRANZ-PETER·Filed 2011·Granted May 5, 2015·6 cites·3 claims
- 0682US11049790B2Electrically insulating thermal interface on the discontinuity of an encapsulation structureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 29, 2021·3 cites·10 claims
- 0782US8522051B2Protection for circuit boardsHANKHOFER JOHANNES·Filed 2007·Granted Aug 27, 2013·22 cites·35 claims
- 0882US7923823B2Semiconductor device with parylene coatingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 12, 2011·10 cites·13 claims
- 0980US8952545B2Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 10, 2015·4 cites·10 claims
- 1079US7781876B2Curing layers of a semiconductor product using electromagnetic fieldsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 24, 2010·8 cites·17 claims
- 1177US9397018B2Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 19, 2016·4 cites·17 claims
- 1274US9093416B2Chip-package and a method for forming a chip-packageMENGEL MANFRED·Filed 2011·Granted Jul 28, 2015·4 cites·15 claims
- 1373US7994646B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 9, 2011·5 cites·16 claims
- 1472US8569109B2Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging moduleMENGEL MANFRED·Filed 2011·Granted Oct 29, 2013·3 cites·29 claims
- 1570US10535542B2Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a waferINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jan 14, 2020·2 cites·18 claims
- 1670US7268423B2Flexible rewiring plate for semiconductor components, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·12 cites·17 claims
- 1769US9790086B2Micromechanical semiconductor sensing deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 17, 2017·1 cites·2 claims
- 1869US9245868B2Method for manufacturing a chip packageTORWESTEN HOLGER·Filed 2012·Granted Jan 26, 2016·3 cites·25 claims
- 1969US7633149B2Integrated circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2005·Granted Dec 15, 2009·4 cites·21 claims
- 2069US4748012AProcess for the reduction of nitrogen oxidesBAYER AG·Filed 1987·Granted May 31, 1988·23 cites·5 claims
- 2167US8884434B2Method and system for improving reliability of a semiconductor deviceMENGEL MANFRED·Filed 2010·Granted Nov 11, 2014·2 cites·15 claims
- 2267US8633600B2Device and method for manufacturing a deviceMENGEL MANFRED·Filed 2010·Granted Jan 21, 2014·2 cites·8 claims
- 2367US7598622B2Encapsulation of a chip moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 6, 2009·3 cites·27 claims
- 2466US8531014B2Method and system for minimizing carrier stress of a semiconductor deviceMENGEL MANFRED·Filed 2010·Granted Sep 10, 2013·2 cites·24 claims
- 2564US9313897B2Method for electrophoretically depositing a film on an electronic assemblyMAHLER JOACHIM·Filed 2012·Granted Apr 12, 2016·1 cites·14 claims
- 2664US8945990B2Chip package and method of forming the sameTORWESTEN HOLGER·Filed 2012·Granted Feb 3, 2015·2 cites·9 claims
- 2763US10546767B2Wafer box, wafer stacking aid, wafer carrier, wafer transport system, method for loading a wafer box with wafers and method for removing wafers from a wafer boxINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jan 28, 2020·1 cites·17 claims
- 2863US8101463B2Method of manufacturing a semiconductor deviceMENGEL MANFRED·Filed 2009·Granted Jan 24, 2012·2 cites·16 claims
- 2963US7811860B2Method for producing a device and deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 12, 2010·2 cites·25 claims
- 3063US7662726B2Integrated circuit device having a gas-phase deposited insulation layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 16, 2010·2 cites·12 claims
- 3161US9318473B2Semiconductor device including a polymer disposed on a carrierMAHLER JOACHIM·Filed 2012·Granted Apr 19, 2016·1 cites·25 claims
- 3261US2021167034A1Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 3360US4220567AStabilizing pigmented lacquers with zeolitesBAYER AG·Filed 1978·Granted Sep 2, 1980·14 cites·6 claims
- 3459US7982292B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 19, 2011·1 cites·20 claims
- 3559US7952188B2Semiconductor module with a dielectric layer including a fluorocarbon compound on a chipINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 31, 2011·1 cites·37 claims
- 3659US7838978B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 23, 2010·1 cites·5 claims
- 3759US2021020541A1Thermal interface material having defined thermal, mechanical and electric propertiesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Application pending·0 cites
- 3857US9313898B2Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutionsMENGEL MANFRED·Filed 2008·Granted Apr 12, 2016·0 cites·1 claims
- 3957US8021919B2Method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2009·Granted Sep 20, 2011·1 cites·19 claims
- 4056US9559078B2Electronic componentINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 31, 2017·0 cites·9 claims
- 4155US9984897B2Method for manufacturing a chip arrangement including a ceramic layerINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 29, 2018·0 cites·19 claims
- 4255US4056370AZeolite A with improved propertiesBAYER AG·Filed 1975·Granted Nov 1, 1977·14 cites·4 claims
- 4353US10930614B2Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 23, 2021·0 cites·16 claims
- 4453US9567211B2Micromechanical semiconductor sensing deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 14, 2017·0 cites·7 claims
- 4552US7915082B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Mar 29, 2011·0 cites·22 claims
- 4652US2019131508A1Thermoelectric Devices and Methods for Forming Thermoelectric DevicesINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 4751US7955873B2Method of fabricating a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2009·Granted Jun 7, 2011·0 cites·24 claims
- 4850US9059083B2Semiconductor deviceEWE HENRIK·Filed 2007·Granted Jun 16, 2015·0 cites·10 claims
- 4950US8947886B2Electronic componentMAHLER JOACHIM·Filed 2011·Granted Feb 3, 2015·0 cites·26 claims
- 5049US8288207B2Method of manufacturing semiconductor devicesMAHLER JOACHIM·Filed 2009·Granted Oct 16, 2012·0 cites·20 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →